Electrochemical deposition of copper using a modified electrode with polyaniline film: Experimental analysis and ANN-based prediction

Millán-Ocampo, D. E.; Porcayo-Calderón, J.; Álvarez-Gallegos, Alberto; Solís-Pérez, J.E.; Hernández-Pérez, José Alfredo; Martı́nez, Susana Silva

doi:10.1016/j.jtice.2021.05.029

Cited by 9 publications

(2 citation statements)

References 46 publications

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“…The main causes of rough coating, pinholes, and other defects in the high-current-density areas of a hull cell are that the current density is too high, the metal copper deposition rate is too fast, which increases concentration polarization, and the cathode hydrogen evolution is aggravated. , As the current density decreases, copper is deposited at a slower pace; concentration polarization slows, and coating deposition becomes denser and less flaky as the electrode gap gradually widens. The PUB2 additive is quickly adsorbed onto the surface of the copper layer on the cathode after being added.…”

Section: Resultsmentioning

confidence: 99%

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Guo,

Liu,

et al. 2024

ACS Omega

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The copper connectivity technique is essential for achieving electrical interconnection in wafer level packaging (WLP), system in packaging (SiP), and 3D packaging. The essential processing material for copper connectivity is a copper sulfate electroplating solution in which organic additives play a crucial role in the regularity of copper electrodeposition. In this study, electrochemical tests, X-ray diffraction, 3D profiling, and scanning electron microscopy were used to investigate the leveling effect and mechanism of polyquaternary ammonium urea-containing polymer (PUB2) in the process of copper electrodeposition on-chip copper connections. PUB2 has excellent polarization ability on the target surface, remains unaffected by the sulfur additive SPS and poly(ethylene glycol), and displays a strong ability to regulate the copper deposition rate of through-holes and surface wiring. The waviness of the wafer surface wiring was reduced from 130 to approximately 70 nm after optimizing the PUB2 concentration, and the surface roughness was reduced from 10 to approximately 7 nm. The coating was dispersed evenly, and the rate of through-hole filling was improved by 57%. This study not only examined PUB2 leveling performance and mechanisms but also devised a research method and system for electroplating additives to facilitate the development and application of new electroplating additives.

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Section: Resultsmentioning

confidence: 99%

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Guo,

Liu,

et al. 2024

ACS Omega

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“…For data analysis, online servers with real-time processing capability will support massive electrochemical data processing. Artificial intelligence (AI) technology based on artificial neural network (ANN) is used to establish the corresponding relationship between input variables and output characteristics due to its excellent modeling ability to describe arbitrary function relations, especially for complex nonlinear systems . All these will help to build a real-time and online monitoring system.…”

Section: Introductionmentioning

confidence: 99%

Online Monitoring of Indole-3-acetic Acid in Living Plants Based on Nitrogen-Doped Carbon Nanotubes/Core–shell Au@Cu₂O Nanoparticles/Carbon Fiber Electrochemical Microsensor

Shi

et al. 2022

ACS Sustainable Chem. Eng.

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Electrochemical sensing is an effective method for trace determination of specific substances. However, there are many active substances in plants, and the pH environment of plant organs varies. These factors directly affect the performance of electrochemical sensors and make it difficult to realize real-time detection accurately. Here, an online intelligent monitoring system for indole-3-acetic acid (IAA) was proposed, including reusable microsensor, portable electrochemical workstation, and online cloud platform. The microsensor was fabricated by depositing nanocomposites of nitrogen-doped carbon nanotubes/core–shell Au@Cu2O nanoparticles on the carbon fiber microelectrode. The IAA microsensor has a wide concentration range of 1–10 000 ng/mL and an ultralow detection limit of 10.8–57.8 pg/mL at a pH range of 4–8. The influence of different pH values on IAA detection was investigated. It is also revealed that the IAA microsensor has good anti-interference ability, repeatability, and stability which are suitable for real-time detection of IAA in living plants. Artificial neural network (ANN) algorithm is employed to establish the relationship between electrochemical signal and IAA concentration, and the ANN model is then configured in the online monitoring system to intelligently obtain the IAA concentration. Based on this system, real-time and online monitoring of the IAA concentration in a living cabbage stem was realized for a long time of 12 h. This study provides a feasible solution based on electrochemical sensing to monitor online the living plant for precision agriculture.

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Artificial intelligence optimization and controllable slow-release iron sulfide realizes efficient separation of copper and arsenic in strongly acidic wastewater

Zhang

Tian

et al. 2024

Journal of Environmental Sciences

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Electrochemical deposition of copper using a modified electrode with polyaniline film: Experimental analysis and ANN-based prediction

Cited by 9 publications

References 46 publications

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Online Monitoring of Indole-3-acetic Acid in Living Plants Based on Nitrogen-Doped Carbon Nanotubes/Core–shell Au@Cu₂O Nanoparticles/Carbon Fiber Electrochemical Microsensor

Artificial intelligence optimization and controllable slow-release iron sulfide realizes efficient separation of copper and arsenic in strongly acidic wastewater

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Electrochemical deposition of copper using a modified electrode with polyaniline film: Experimental analysis and ANN-based prediction

Cited by 9 publications

References 46 publications

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Online Monitoring of Indole-3-acetic Acid in Living Plants Based on Nitrogen-Doped Carbon Nanotubes/Core–shell Au@Cu2O Nanoparticles/Carbon Fiber Electrochemical Microsensor

Artificial intelligence optimization and controllable slow-release iron sulfide realizes efficient separation of copper and arsenic in strongly acidic wastewater

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Product

Resources

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Online Monitoring of Indole-3-acetic Acid in Living Plants Based on Nitrogen-Doped Carbon Nanotubes/Core–shell Au@Cu₂O Nanoparticles/Carbon Fiber Electrochemical Microsensor