2007
DOI: 10.1007/s10853-007-1926-x
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Electrochemical deposition of Ni and Cu onto monocrystalline n-Si(100) wafers and into nanopores in Si/SiO2 template

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Cited by 45 publications
(24 citation statements)
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“…The regimes of mesoporous SiO 2 layer production by the NITEM technology were described in [6]. These nanopores having the diameters 100-250 nm and heights about 400-500 nm were filled with Ni to form a system of nanorods-in-pores (NRIPs) randomly distributed within the SiO 2 layer.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The regimes of mesoporous SiO 2 layer production by the NITEM technology were described in [6]. These nanopores having the diameters 100-250 nm and heights about 400-500 nm were filled with Ni to form a system of nanorods-in-pores (NRIPs) randomly distributed within the SiO 2 layer.…”
Section: Methodsmentioning
confidence: 99%
“…A thickness of the films with the granules measuring approximately 10-70 nm was close to the height of Ni-NRIPs in n-Si/ SiO 2 /Ni nanostructures (≈ 500 nm). The procedures of Ni electrodeposition into the pores together with their SEM images were presented in our previous paper [6].…”
Section: Methodsmentioning
confidence: 99%
“…The procedure and regimes of a mesoporous SiO 2 layer fabrication by the ITEM technology were described in detail earlier [6]. These nanopores having the diameters 100250 nm and heights about 400500 nm were lled with Ni to form NRIPs contacting with Si substrate.…”
Section: Methodsmentioning
confidence: 99%
“…Investigation of such structures creates preconditions for modeling of electron devices with the Schottky barrier possessing non-linear voltampere characteristics including the negative differential impedance. Realization of the formulated idea would allow developing magnetic field sensors with enhanced sensitivity [14].…”
Section: Figmentioning
confidence: 99%