Electrochemical effect of Copper Gleam additives during copper electrodeposition

Abstract

Electrochemical nano and micro fabrication by Flow and Chemistry is a maskless micropatterning technology that uses an acid-free and low ion concentration electrolyte. However, the effects of additives on the electrochemical behaviour of this type of electrolyte are still unknown; hence, their role during micro-and nano-fabrication is unpredictable. This study