2007
DOI: 10.1007/s10800-007-9336-y
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Electrochemical investigation of the passive behaviour of biomaterials based on Ag–Sn and Cu–Zn–Al in carbonate buffer in the absence and presence of chloride

Abstract: The electrochemical behaviour of biomaterials based on Cu-Zn-Al (cubic Cu 3 Zn phase) and Ag-Sn (orthorhombic Ag 3 Sn and hexagonal Ag 4 Sn phases) alloys was investigated in carbonate buffer solutions (pH 9.66) in the absence and presence of chloride, using different electrochemical techniques. Analyses of the open circuit potential and the potentiodynamic polarisation curves showed that the passivation domain and the corrosion parameters depend on alloy composition and chloride concentration. Chronoamperomet… Show more

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Cited by 6 publications
(7 citation statements)
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“…This behavior points to an increase in the polarization resistance of the barrier passive layer on zinc surface as the pH of its contact electrolyte is increased. 20,27 The results of polarization are in good consistency with the behavior of OCP and EIS measurements indicating that buffer carbonate/bicarbonate solution with higher pH value facilitates the formation of a more resistive passive lm on Zn metal with better barrier protection. 3.1.2 Effect of temperature.…”
Section: àsupporting
confidence: 68%
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“…This behavior points to an increase in the polarization resistance of the barrier passive layer on zinc surface as the pH of its contact electrolyte is increased. 20,27 The results of polarization are in good consistency with the behavior of OCP and EIS measurements indicating that buffer carbonate/bicarbonate solution with higher pH value facilitates the formation of a more resistive passive lm on Zn metal with better barrier protection. 3.1.2 Effect of temperature.…”
Section: àsupporting
confidence: 68%
“…The results in Table 6 reveal continuous increase in the negative value of E FB with the increase in the alkalinity of the medium, being À0.170 V at pH 9.2 and reaching À0.282 V at pH 9.8. This trend indicates lowering in the overpotential for the charge transfer reaction at the semiconductor passive lm/ electrolyte interface and suggests a more facile lm growth on zinc surface in the most basic buffer medium 5,16,27 in good (Table 6), but it decreases with the temperature rise 39 ( Table 7). This could be correlated to a change in the lm thickness (d), being increased with pH and decreased with the increment of formation temperature, as proven from the values of the lm thickness (d) estimated from the impedance data using eqn (4) and illustrated by the bar diagram in Fig.…”
Section: Semiconducting Propertiesmentioning
confidence: 99%
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“…This behavior hints to a decrease in the corrosion susceptibility of the metal substrate owing to an increase in the protective efficacy of the formed passive lm with increasing its processing V a value. 36,37 Based on the parallel plate capacitor model, the capacitance of the interface is related to the passive lm thickness (d f ) according to the following relation: 28,38,39 C t ¼ 33 0 A/d f (5) where 3 is the dielectric constant of the passive lm (8.5 for ZnO), 40 3 0 is the permittivity of the free space (8.854 Â 10 À14 F cm À1 ) and A is the geometric surface area of the electrode. Eqn (5) indicates a reverse correlation between C t and d f which points towards a direct increase in the lm thickness (d f ) with increasing the anodizing voltage (V a ) as depicted in Fig.…”
Section: Resultsmentioning
confidence: 99%