1975
DOI: 10.1039/c39750000200
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Electrochemical metallization at the liquid–liquid interfaces of non-miscible electrolytic solutions

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Cited by 69 publications
(45 citation statements)
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“…These processes include the deposition of a metal such as Cu at the ITIES [142], the preparation of colloidal metal particles with catalytic properties for homogeneous organic reactions [143], electropolymerization [144], and electron transfer through a ground [145] or excited state localized at the ITIES (photocatalysis) [146], cf. also Fig.…”
Section: Electrocatalysismentioning
confidence: 99%
“…These processes include the deposition of a metal such as Cu at the ITIES [142], the preparation of colloidal metal particles with catalytic properties for homogeneous organic reactions [143], electropolymerization [144], and electron transfer through a ground [145] or excited state localized at the ITIES (photocatalysis) [146], cf. also Fig.…”
Section: Electrocatalysismentioning
confidence: 99%
“…The drawback of studying nucleation and growth through electrochemistry on a solid electrode is the presence of defects on the electrode surface which act as preferential nucleation sites causing heterogeneity within the reaction [19]. An alternative is to study the processes occurring at a liquid/liquid interface [20], where the interface between the two immiscible fluid phases provides a defect free substrate to follow the nucleation. The reaction at the liquid/liquid interface is considered analogous to that at a liquid/solid interface, i.e.…”
Section: Introductionmentioning
confidence: 99%
“…The first evidence of electron transfer at liquid/liquid interfaces were found by Guainazzi et al (Girault, 1993;Guainazzi, 1975). They could reduce Cu(III) in aqueous phase to Cu(0) using hexacarbonylvanadate tetrabutylammonium in 1,2-dichloroethane.…”
Section: Electron Transfermentioning
confidence: 84%