Electrochemical micromachining of micro-dimple arrays using a polydimethylsiloxane (PDMS) mask

Chen, Xiaolei; Qu, Ningsong; Li, Hansong; Xu, Zhengyang

doi:10.1016/j.jmatprotec.2015.09.008

Cited by 61 publications

(29 citation statements)

References 21 publications

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“…It was further discovered from Figure.14 that the minimum CV depth and CV diameter are 5.4% and 1.9%, respectively, when the appropriate combination of the applied voltage (8.5 V) and the moving speed (0.5 m/s) are used, showing a considerably narrower variation range of 43.7-51.3 μm in depth and 370.9-394.9 μm in diameter. To the best knowledge of the authors from the reported literature, the CV values obtained in our study are sufficiently small to reach the levels that were obtained from the standard photolithographic photoresist electrochemical machining process [20,21,28], and they are also smaller than those achieved with the first version foamed cathode TMEMM process [30].…”

Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 44%

“…In this novel process, the mask is pressed mechanically against the workpiece, and thus, it can be reused repeatedly, showing a favorable operational convenience and cost-effective superiority. Additionally, in this novel process, Qu et al [25][26][27][28] used polydimethylsiloxane (PDMS) film as the reusable mask due to its good pliancy property. However, fixture of the reusable through-mask on the workpiece is still a significant issue.…”

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confidence: 99%

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Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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A through-mask electrochemical micromachining process with a foamed cathode (foamed-cathode through-mask electrochemical micromachining (TMEMM)) has recently been proposed involving micro-scale surface microstructures with a high geometric consistency that are fabricated on the curved-surface workpiece. In this paper, to make the foamed-cathode TMEMM process more cost-efficient in the applications, significant modifications are made to this process and an upgraded version of the foamed-cathode TMEMM process is developed. In this modified process, the sandwich-like unit (including the foamed cathode, mask, and workpiece) is closely assembled by the magnetic field force instead of the conventionally-used mechanical force and is kept moving up-and-down inside the electrolyte, avoiding the use of the traditional pump-driven circulation for the electrode process. Experiments are carried out to evaluate the machining effect of this modified TMEMM for fabricating micro-dimples. The research results verify that this modified TMEMM process can produce highly uniform micro-dimples whose minimum CV (coefficient of variation) values in depth and in diameter are 5.4% and 1.9%, respectively, with smooth surfaces of the minimum Ra being 0.21-0.35 µm. These values are smaller than those previously reported. This results in the positive effects on the mass transfer driven by magnetohydrodynamic convection induced by the magnetic field within the interelectrode and the foamed electrode.Micromachines 2020, 11, 188 2 of 14 is very tedious and expensive. In addition, the photoresist through-mask cannot be well formed on the curved surface; as a result, the traditional TMEMM process is somewhat limited in industrial applications. Consequently, effort has been made to facilitate the preparation of the through-mask by researchers. For instance, Landolt et al. and Chauvy et al. [13,14] employed patterned oxide film as the through-mask to texturize titanium. Asoh et al. [15] presented a novel TMEMM process to accomplish the formation of large-scale microstructures just by using the self-assembled polystyrene colloidal crystal particles as the through-mask. In an unusual way, Schönenberger et al. [16] and Costa et al. [17,18] bonded the through-mask to the cathode surface instead of the workpiece surface (anode) to carry out the micro-pattern transferring operation. Recently, further optimized the preparation of the through-mask of this kind of cathode-typed TMEMM by using the removable dry film through-mask, resulting in high cost-effectiveness.Unlike the conventional TMEMM processes using the bonded through-mask, a removable and reusable through-mask electrochemical machining process was exploited by Zhu et al. [22][23][24]. In this novel process, the mask is pressed mechanically against the workpiece, and thus, it can be reused repeatedly, showing a favorable operational convenience and cost-effective superiority. Additionally, in this novel process, Qu et al. [25][26][27][28] used polydimethylsiloxane (PDMS) film as the reusable mask d...

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Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 44%

mentioning

confidence: 99%

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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“…A wide range of hard yet conductive materials such as bulk metallic glasses [ 4 ], titanium alloys [ 5 ], superalloys [ 6 ], carbide-metals [ 7 , 8 ] can be effectively machined by ECMM. Several configurations of ECMM process such as jet electrochemical machining [ 9 ], scanning micro-electrochemical flow cell based ECMM [ 10 ], wire electrochemical micromachining [ 11 ], a tool-based hybrid laser-ECM [ 12 ] and through-mask electrochemical micro-machining [ 13 ] have been introduced to generate surface microstructures.…”

Section: Introductionmentioning

confidence: 99%

“…Reference [ 26 ] reported that a mask with cone-shaped holes is beneficial for the electrolyte flow. Reference [ 13 ] proposed a modified forward electrolyte flow mode with a multi-slit structured cathode for good distribution of electrolyte flow field. All of the aforementioned methods are indeed very useful and inventive but require sophisticated equipment designed for structuring with predefined scales or shapes and require further research for real applications.…”

Section: Introductionmentioning

confidence: 99%

Fast Fabrication of Complex Surficial Micro-Features Using Sequential Lithography and Jet Electrochemical Machining

Saxena

Guo

et al. 2020

Micromachines

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This paper presents fabrication of complex surficial micro-features employing a cross-innovative hybrid process inspired from lithography and Jet-ECM. The process is referred here as mask electrolyte jet machining (MEJM). MEJM is a non-contact machining process which combines high resolution of lithography and greater flexibility of Jet-ECM. It is a non-contact process which can fabricate variety of microstructures on difficult-to-machine materials without need of expensive tooling. The presented work demonstrates the process performance of this technology by statistical analysis and multivariate kernel density estimation (KDE) based on probabilistic density function. Micro-letters are fabricated as an example of complex surficial structure comprising of multiple intersecting, straight and curved grooves. The processing response is characterized in terms of geometrical size, similarity ratio, and cumulative shape deviation. Experimental results demonstrated that micro letters with good repeatability (minimum SD of shape error ratio 0.297%) and shape accuracy (minimum shape error of 0.039%) can be fabricated with this technology. The results suggest MEJM could be a promising technology for batch manufacturing of surface microstructures with high productivity.

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“…Considering that metals are one of the most widely used materials, an effective method to fabricate superhydrophobic array structures on engineering metals has great significance for moving superhydrophobic surfaces towards real-world applications. Mask electrochemical machining (MECM), which combines photolithography and micro electrochemical machining, is widely used to prepare micro-pits arrays on engineering metal materials because of its low cost, easy operation process and high machining efficiency [19][20][21][22]. Here, we extended this technique into the area of fabricating superhydrophobic post arrays on aluminum (Al) substrates.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Superhydrophobic Micro Post Array on Aluminum Substrates Using Mask Electrochemical Machining

Sun

Cheng

Song

et al. 2018

Chin. J. Mech. Eng.

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Surfaces with controllable micro structures are significant in fundamental development of superhydrophobicity. However, preparation of superhydrophobic surfaces with array structures on metal substrates is not effective using existing methods. A new method was presented to fabricate super-hydrophobic post arrays on aluminum (Al) substrates using mask electrochemical machining and fluoridation. Electrochemical etching was first applied on Al plates with pre-prepared photoresist arrays to make the post array structures. Surface modification was subsequently applied to reduce the surface energy, followed by interaction with water to realize superhydrophobicity. Simulation and experimental verification were conducted to investigate how machining parameters affect the array structures. Analysis of the water contact angle was implemented to explore the relationship between wettability and micro structures. The results indicate that superhydrophobic surfaces with controllable post structures can be fabricated through this proposed method, producing surfaces with high water static contact angles.

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Electrochemical micromachining of micro-dimple arrays using a polydimethylsiloxane (PDMS) mask

Cited by 61 publications

References 21 publications

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Fast Fabrication of Complex Surficial Micro-Features Using Sequential Lithography and Jet Electrochemical Machining

Fabrication of Superhydrophobic Micro Post Array on Aluminum Substrates Using Mask Electrochemical Machining

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