Electrochemical micromachining using a solid electrochemical reaction at the metal/β″-Al2O3 microcontact

Kamada, Kei; Tokutomi, Masaaki; Enomoto, Naoya; Hojo, Junichi

doi:10.1016/j.electacta.2006.10.052

Cited by 6 publications

(3 citation statements)

References 32 publications

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“…A similar trend was observed for the Ag^Na-b÷ -Al 2 O 3 microcontact. 10 The initial voltage rise may be due to the inhomogeneous solid-solid contact. Previous papers 12 ,13 reporting the current-time behavior at the solid-solid interface of Ag^Ag conductors have suggested that the reduction of the actual contact area by electrodifussion and production of atomic scale lattice defects on the Ag surface increases the overvoltage under galvanostatic conditions.…”

Section: Results and Discussion 31 Ion Migration Mechanism During Somentioning

confidence: 99%

Solid Electrochemical Micromachining Using a Tungsten Microelectrode Coated with a Polymer Electrolyte

Kamada

Tokutomi

Inada

et al. 2007

J. Ceram. Soc. Japan

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Electrochemical micromachining of a metal plate was performed using a solid polymer electrolyte. The fundamental electrolysis system was composed of a metal plate anode ^polymer electrolyte^tungsten needle cathode , where the contact diameter of the metal^polymer interface was extremely small a few mm . The metal substrate was electrochemically oxidized and then M n ions migrated to the polymer electrolyte. As a result of the continuous application of a dc voltage to the cell, finer-resolution micromachining Ĭ10 mm was achieved under room-temperature operation as compared with our previous results obtained using a Na-b÷ -Al 2 O 3 solid electrolyte. Furthermore, the present technique was applicable to many different kinds of metal substrates.

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Section: Results and Discussion 31 Ion Migration Mechanism During Somentioning

confidence: 99%

Solid Electrochemical Micromachining Using a Tungsten Microelectrode Coated with a Polymer Electrolyte

Kamada

Tokutomi

Inada

et al. 2007

J. Ceram. Soc. Japan

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“…As a result of continuous electrolysis, the metal substrate was locally consumed at the microcontact, and thus the SSEM is accomplished. In fact, various metal substrates (Ag, Cu, and Zn) could be grooved using the Na-¢¤¤-Al 2 O 3 pyramid, 39) where the metal ions eliminated from the substrate were detected in the cross section of the Na-¢¤¤-Al 2 O 3 . Thus, the ion migration mechanism proposed above actually proceeded during the electrolysis.…”

Section: Solid State Electrochemical Micromachiningmentioning

confidence: 99%

Application of ion conductors for microfabrication of solid surface

Kamada

2010

J. Ceram. Soc. Japan

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The present paper describes novel microfabrication techniques which utilize an ion migration at the microcontact between ion conductor and target solid. Two different methods have been recently proposed by our group. One is a solid state electrochemical route for pinpoint doping using an ion conductor. In this approach, an electric field is applied to the solidsolid interface between the cation conductor and target solid, inducing the injection of cations into the target. A significant advantage of this technique is that it enables pinpoint doping into desired locations within a solid target using the ion conductor having an extremely small contact area. On the other hand, we have also investigated an electrochemical microstructuring (i.e., micromachining) of metal surface through an anodic reaction of metal substrate attached to the needle-like ion conductor. The metal substrate is electrochemically oxidized, and then dissolves as M n+ into the ion conductor placed at the cathodic side. As a result of the continuous application of electric field, the metal surface is drilled according to the apex form of the ion conductor employed. This paper reveals the characteristics (merits and demerits) of the present techniques vis-a-vis conventional techniques for doping or micromachining.

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“…Our group has recently proposed a simple solid state technique for the electrochemical micromachining of metal substrates using a metal ion conductor [13][14][15]. In this method, the metal substrate is locally oxidized and then incorporated into the ion conductor in the form of metal ions via the microcontact between the metal substrate and ion conductor.…”

Section: Introductionmentioning

confidence: 99%

Surface micromachining via solid electrochemical reaction on oxide ion conductors

et al. 2009

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We propose a simple and novel route for the surface microstructuring of tough materials (glassy carbon, SiC, W and Mo) through a solid electrochemical reaction at a microcontact between the oxide ion conductor and target substrate. More specifically, the surface of materials was locally oxidized by an anodic electrochemical reaction with the oxide ion conductor via the microcontact under a dc bias. Since the oxidation products of the targets were gaseous or sublimable, a fine-patterned surface was obtained as a result of the continuous consumption of the oxidation products formed at the microcontact. The success of the proposed method may stimulate such conventional applications of oxide ion conductors.

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Electrochemical micromachining using a solid electrochemical reaction at the metal/β″-Al2O3 microcontact

Cited by 6 publications

References 32 publications

Solid Electrochemical Micromachining Using a Tungsten Microelectrode Coated with a Polymer Electrolyte

Solid Electrochemical Micromachining Using a Tungsten Microelectrode Coated with a Polymer Electrolyte

Application of ion conductors for microfabrication of solid surface

Surface micromachining via solid electrochemical reaction on oxide ion conductors

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