Electrochemical Migration Investigations on SAC-Bi-xMn Solder Alloys

Medgyes, Bálint; Roman, Emil; Bohnert, Adam; Szurdan, Szabolcs; Zhong, Xiankang; Harsányi, Gábor

doi:10.1109/siitme.2018.8599238

Cited by 9 publications

(4 citation statements)

References 10 publications

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“…The ECM on the PCB is mainly short-circuited by the formation of Sn dendrites, which are more resistant when they are alloyed with metals such as Cu or Ag than pure Sn [16]. Therefore, for solder to bond to the PCB, various alloys of Sn are being used to increase the resistance of the ECM [19][20][21][22][23][24][25][26].…”

Section: Introductionmentioning

confidence: 99%

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid environment, electrochemical migration (ECM) will occur, with the cathode and anode on the surface of the MLCC encountering each other. This can result in product damage due to a short circuit. In this study, the effects of voltage, NaCl concentration, and distance between electrodes on a non-mount MLCC, surface mount MLCC, and solder pad pattern were evaluated using a water drop test (WDT). Based on the analysis of the effects of the presence of conformal coating, applied voltage, concentration of NaCl, and the distance between electrodes, a mechanism model for ECM behavior in MLCCs was proposed.

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Section: Introductionmentioning

confidence: 99%

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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“…[6]. Other researches tried to improve the mechanical properties of the SAC alloy with further alloying of Bi and Mn in a higher amount between 0.1-1 wt% [7,8]. Lin et al [9] reached significant mechanical improvement during drop tests in the case of low Ag content Sn-l.0Ag-0.5Cu alloys doped with Mn and Ti (0.15 and 0.5wt%).…”

Section: Introductionmentioning

confidence: 99%

Whisker Development from SAC0307-Mn07 Solder Alloy

Illés

Batorfi

Hurtony

et al. 2020

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

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In this study, the whisker growth from SAC0307-Mn07 solder alloy was investigated. To get fast information, an ultra-thin film was vacuum evaporated from the examined solder alloy onto Cu substrates. The evaporated layer was ~100-150nm thick in average with the same grain size. The layers were kept at room temperature for 28 days. Whisker growth was monitored by scanning electron microscope with some days frequency, and the layer structure under the whisker was examined on focused ion beam cuts. The large mechanical stress on the Sn layer due to the intermetallic layer growth initiated the whisker growth right after the layer deposition. However, it stopped after 2 weeks since the intermetallic grains consumed the ultra-thin Sn layer. The whisker density was extremely high (~24000 pcs./mm 2). Most of the whiskers were the short nodule and hillock type, which does not mean risk in microelectronics. Therefore, the alloying of Mn into the high Sn content solder alloys have a positive effect on the reliability of the solder joints.

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“…Tang et al found that the optimal weight percentage of manganese nanoparticles is 0.05 wt.% to enhance the wettability of SAC alloys. The addition of minor composing elements allows the amount of silver in SAC solders to be reduced, which can result both in reliability increase [ 26 ] and significant cost reduction.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

et al. 2020

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Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20–25 N) compared with the SAC305 alloy (27–35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder–substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

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Electrochemical Migration Investigations on SAC-Bi-xMn Solder Alloys

Cited by 9 publications

References 10 publications

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Whisker Development from SAC0307-Mn07 Solder Alloy

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

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