Electrochemical Migration Issues Related to Improper Solder Mask Application

Veselý, Petr; Klimtova, Marketa; Froš, Denis

doi:10.1109/isse54558.2022.9812811

Cited by 2 publications

(2 citation statements)

References 10 publications

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“…A large amount of dendrites were formed, which were confirmed to be metallic dendrites by surface analysis. Meanwhile, according to many research results on ECM [36], ECM is easily generated when corrosive substances are in solution. However, ECM is generated even when the relative humidity is controlled using distilled water as a corrosive environment [36].…”

Section: Discussionmentioning

confidence: 99%

“…Meanwhile, according to many research results on ECM [36], ECM is easily generated when corrosive substances are in solution. However, ECM is generated even when the relative humidity is controlled using distilled water as a corrosive environment [36]. Therefore, the cause of ECM not occurring in surface mount MLCCs cannot be considered to be related to the concentration of the corrosion solution.…”

Section: Discussionmentioning

confidence: 99%

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Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid environment, electrochemical migration (ECM) will occur, with the cathode and anode on the surface of the MLCC encountering each other. This can result in product damage due to a short circuit. In this study, the effects of voltage, NaCl concentration, and distance between electrodes on a non-mount MLCC, surface mount MLCC, and solder pad pattern were evaluated using a water drop test (WDT). Based on the analysis of the effects of the presence of conformal coating, applied voltage, concentration of NaCl, and the distance between electrodes, a mechanism model for ECM behavior in MLCCs was proposed.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Yoo,

Won,

Kim

2024

Coatings

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Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Klimtová,

Veselý,

Králová

et al. 2024

Materials

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Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

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Electrochemical Migration Issues Related to Improper Solder Mask Application

Cited by 2 publications

References 10 publications

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

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