Electrochemical migration of tin in electronics and microstructure of the dendrites

Minzari, Daniel; Grumsen, Flemming Bjerg; Jellesen, Morten Stendahl; Møller, Per; Ambat, Rajan

doi:10.1016/j.corsci.2011.01.009

Cited by 62 publications

(37 citation statements)

References 13 publications

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“…According to the EDS results the dominant migration element is Sn in the dendrites as well as in the residues. The residue is probably Sn(OH) 2 or Sn(OH) 4 .…”

Section: Ecm Of Ag and Sn In 10 MM Nacl Solutionmentioning

confidence: 99%

“…One of the most common contaminant is the Cl, which can strongly modify the electrochemical corrosion mechanism and therefore, the migration ability of tin and silver as well. Tin and silver ions can combine with hydroxide groups and also with Cl -ions and form complexes in aqueous solutions [4,17]. The impact of chloride ion on Sn and Ag ECM behavior was already investigated at low concentrations [17,18].…”

Section: Introductionmentioning

confidence: 99%

“…ECM may cause a relative high reliability risk regarding electronics applications [4]. This failure phenomenon occurs at the presence of humidity in the case of operating circuits: the dissolution of metal traces begins at the anode and produces metal ions, which are directed by the applied electric field and move to the cathode, where they can reduce as pure metals -dendrites (See Fig.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Electrochemical migration of Sn and Ag in NaCl environment

Medgyes

Szivos

Adam

et al. 2016

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Abstract-The impact of chloride ion concentration on electrochemical migration (ECM) of tin and silver was studied by using an in-situ optical and electrical inspection system. It was found, that in both cases, dendrites grow not only in an electrolyte solution at low chloride concentration but also in an electrolyte at medium and high or even saturated chloride concentrations as well. According to the results, the migration susceptibility has decreased at low and medium concentration levels in both cases. However, the ECM susceptibility of Ag has increased, while the migration susceptibility of Sn was decreased at the saturated concentrations.

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“…According to the EDS results the dominant migration element is Sn in the dendrites as well as in the residues. The residue is probably Sn(OH) 2 or Sn(OH) 4 .…”

Section: Ecm Of Ag and Sn In 10 MM Nacl Solutionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Electrochemical migration of Sn and Ag in NaCl environment

Medgyes

Szivos

Adam

et al. 2016

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

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“…Electrochemical migration (ECM) is a failure phenomenon which may cause high reliability risk in electronics applications [1]. The failure mechanism starts with dissolution of the anode, which produces metal ions.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of lead-free solder alloys in Na<inf>2</inf>SO<inf>4</inf> environment

Medgyes

Adam

Tar

et al. 2017

2017 40th International Spring Seminar on Electronics Technology (ISSE)

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“…Many types of metals that are widely used in the electronics have relevant ability for ECM, such as tin, silver or copper [2]. Next to Ag, Cu and Sn are also widely studied from the ECM point of view [2][3][4][5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%