Electrochemical migration tests of solder alloys in pure water

Takemoto, Tadashi; Latanision, R. M.; Eagar, T. W.; Matsunawa, Akira

doi:10.1016/s0010-938x(97)00038-3

Cited by 75 publications

(46 citation statements)

References 18 publications

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“…ECM is a typical form of corrosion found on electronic systems [3], [4] due to the presence of susceptible metals such as Cu, Ag, Sn, Pb, etc. ECM occurs due to the presence of a potential gradient between two susceptible conductors (Cu, Ag, Sn, Pb, etc., on PCB) connected by a thin layer of solution.…”

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confidence: 99%

“…However, the solder paste contains flux, and for varying Pb content, the flux chemistries could be different and remnants of the solder flux could greatly affect the migration process. In addition, the surface roughness of the solder on a silicon wafer could be different than on a PCB, thereby influencing the ECM behavior [4]. Such factors make reliable reproduction of experiments extremely difficult, thereby complicating interpretation and comparison of experimental results.…”

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confidence: 99%

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Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari

Jellesen

Møller

et al. 2009

IEEE Trans. Device Mater. Relib.

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Abstract-Electrochemical migration behavior of end terminals on ceramic chip resistors (CCRs) was studied using a novel experimental setup in varying sodium chloride concentrations from 0 to 1000 ppm. The chip resistor used for the investigation was 10-kΩ CCR size 0805 with end terminals made of 97Sn3Pb alloy. Anodic polarization behavior of the electrode materials was investigated using a microelectrochemical setup. Material makeup of the chip resistor was investigated using scanning electron microscopy (SEM)/energy dispersive spectroscopy and focused-ion-beam SEM. Results showed that the dissolution rate of the Sn and stability of Sn ions in the solution layer play a significant role in the formation of dendrites, which is controlled by chloride concentration and potential bias. Morphology, composition, and resistance of the dendrites were dependent on chloride concentration and potential.

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confidence: 99%

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confidence: 99%

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari

Jellesen

Møller

et al. 2009

IEEE Trans. Device Mater. Relib.

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“…Subsequently, a conducting filament, or dendrite, will grow out of the cathode and eventually bridge the cathode and anode, resulting in a short circuit in electronic devices. The situation will be even worse under high temperature conditions and high electric field [3][4][5], making the ECM reliability issue more critical in high power modules.…”

Section: Introductionmentioning

confidence: 99%

“…In this study, the behaviors and susceptibilities of ECM of four specific Ag-In alloys and two pure silver materials were examined via the water drop test (WDT) in deionized water and applied electric field. The WDT is a commonly used accelerated testing method for the measurement of ECM resistance [1][2][3][4][5][6][7][13][14][15][16]. The compositions of all the tested samples are: Ag, Ag-In solid solutions with 10 at.% In and 19 at.% In (which will be denoted as (Ag)-10In and (Ag)-19In in the following article), Ag 3 In and Ag 9 In 4 , as labeled in the Ag-In binary phase diagram in Fig.…”

Section: Introductionmentioning

confidence: 99%

Analyses and design for electrochemical migration suppression by alloying indium into silver

Yang

Lee

et al. 2018

J Mater Sci: Mater Electron

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Silver electrochemical migration (ECM) is a serious reliability issue for fine pitch as well as power electronic devices that employ silver as interconnection materials. In this study, a method to suppress the ECM behavior of silver was proposed and implemented. Solid solutions of Ag-In and intermetallic compounds were fabricated and their ECM properties were studied through the water drop test (WDT). The WDT was performed on alumina substrate in deionized water at 3 V, where the leakage current was measured. The results show that Ag-In alloy samples have considerably longer lifetime before reaching short circuit than pure silver samples. As indium concentration in Ag-In solid solution increases, the resistance to ECM also increases. The migration process is completely inhibited when the indium concentration reaches 19 at.%. The morphologies of the dendrites and surfaces of the anode and cathode were also investigated. A model was established to explain the anti-ECM mechanism of Ag-In alloys. By forming indium oxide on the surface of the anode under electric field in a humid environment, the anode gets passivated and the silver dissolution path is completely blocked, and thus inhibiting the ECM process. It was discovered that the quality of electrode surfaces is essential in realizing the full potential of the inherent anti-ECM ability of Ag-In alloys. In conclusion, the results of this investigation have shown that Ag-In alloys can be promising and valuable candidates for conductors, metallization, and interconnect materials in fine pitch and high power electronic devices.

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“…Takemoto et al have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in IntroductionIn microelectronics industry, the applied solder materials are one of the most important factors related to the reliability of the products. According to the Restrictions of Hazardous Substances (RoHS) directive of European Union, lead bearing solders had to be replaced with lead-free ones [1]. In this context, alternative binary alloys had been examined as replacements for SnPb solders, such as near-eutectic SnAg, SnCu and SnZn alloys. However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].The reliability investigation of lead-free solders is still a current issue. One of the important reliability topics is the electrochemical migration (ECM) failure phenomenon. The common characteristics of the ECM phenomenon include the presence of moisture on conductor-dielectric-conductor systems under bias voltage, the electrochemical process and the metallic dendrite growth. This process is driven by the applied electric field from the anode to the cathode. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in needle or tree-like formations. This effect causes short-circuits in electronic circuits, which may lead to a catastrophic failure.Many papers can be found about ECM investigations carried out on different lead-free solder alloys. Takemoto et al. have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al. have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].Other publication reported that SAC305 lead-free solder alloy has longer ECM lifetime in 0.001% NaCl solution than in 0.001% Na2SO4, since the passivity layer formed of SnO2 is thicker in the case of NaCl solution and Sn is the only element that contributes to ECM at room temperature [11]. The migration behaviour and the deposition process of Sn, Cu and Ag in case of SAC305 solder alloy were also observed in a thermal-

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Electrochemical migration tests of solder alloys in pure water

Cited by 75 publications

References 18 publications

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Analyses and design for electrochemical migration suppression by alloying indium into silver

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

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