Electrochemical recovery of damaged bonding area during failure analysis of the modern integrated circuits

Zubov, D. N.; Kelm, E.; Милованов, Р. А.; Molodtsova, G.

doi:10.1117/12.2181191

SPIE Proceedings

2014

DOI: 10.1117/12.2181191

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Electrochemical recovery of damaged bonding area during failure analysis of the modern integrated circuits

D. N. Zubov¹,

E. Kelm²,

Р. А. Милованов³

et al.

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Electrochemical recovery of damaged bonding area during failure analysis of the modern integrated circuits

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