Electrochemical studies of the kinetics and mechanism of brass dezincification

Polunin, A. V.; Pchel'nikov, A. P.; Losev, V. V.; Маршаков, И. К.

doi:10.1016/0013-4686(82)85025-1

Cited by 70 publications

(33 citation statements)

References 5 publications

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“…Equation 13, a Butler-Volmer expression, allows for nickel dissolution during the off-time, and the amount of copper and nickel deposited will change accordingly. The corrosion model is solved using the same algorithm as for the no-corrosion ease (see the Appendix).…”

Section: Qc~ Fo Tp Icudt + I~t~mentioning

confidence: 99%

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Matlosz

Landolt

1994

J. Electrochem. Soc.

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Copper and nickel are codeposited by pulse and reverse-pulse plating on a rotating cylinder cathode from a citrate bath. Polarization data for copper and nickel as well as potential transients during pulse and reverse-pulse current experiments show that displacement reactions may occur during the pulse off-time or pulse-reversal time. A mathematical model which includes this effect is developed to predict the composition of electrodeposited alloys. The model shows that copper deposits at the mass-transfer limiting current throughout the pulse-cycle while nickel is alternately deposited and dissolved during the pulse on-time and off-time (or reversal time). The alloy composition is governed by pulse parameters and the diffusion limiting current for copper deposition.Due to the importance of pulsed currents in alloy electrodeposition, 1-4 a variety of investigations have focused on determining the fundamental relationships between applied pulse-parameters, governing physical phenomena (such as reaction kinetics and hydrodynamics), and the composition of the deposit. Verbrugge and Tobias~'6 proposed a theoretical model which could be used to calculate current-voltage relationships, metal ion concentration at the cathode, and deposit composition during the electroplating of a multicomponent alloy using periodic currents. Their model included the equation of convective diffusion to describe liquid-phase mass transfer at a rotating disk, Butler-Volmer expressions to calculate the rate of chargetransfer reactions at the electrode surface, and activities of individual metals in the solid-state to compute the composition of the deposit. They investigated numerically the effect of hydrodynamics, reactant concentration, reversible potentials, and solid-state activity on the deposit composition of a Cd-Te alloy. Pesco and Cheh 7 used a treatment similar to that of Verbrugge and Tobias, except that solidstate activities were neglected. They computed the composition of Pb-Sn alloys plated at a rotating disk electrode under mixed mass-transfer and kinetic control. Ruffoni and Landolt ~ investigated experimentally the variation in the composition of Au-Cu-Cd alloys as a function of applied pulse parameters and hydrodynamics. The results were compared with the prediction of a mathematical model which took into account the kinetic behavior of the three alloy components and hydrogen. 9 More recently White and co-workers ~~ have presented a theoretical model which includes the effects of migration on ion transport and of addition agents on reaction kinetics of the depositing metals.During pulse-plating of binary a11oys, the applied current is cycled between a high and a low or zero value. At high current density, both alloying dements are reduced at the cathode, but at low current density or at the opencircuit potential the less noble metal can be selectively dissolved or displaced from the alloy by the more noble one. n46 The numerical analysis of Verbrugge and Tobias 5 has already indicated that the more noble component may contin...

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Section: Qc~ Fo Tp Icudt + I~t~mentioning

confidence: 99%

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Matlosz

Landolt

1994

J. Electrochem. Soc.

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“…Brasses are technologically important materials and have been studied extensively, especially in terms of dezincification [1][2][3], corrosion inhibition [4][5][6][7][8][9] and stress corrosion cracking [10][11][12][13][14]. Passivation in slightly alkaline solution, with and without addition of chloride, has not received much attention [15][16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Passivity and Corrosion of Cu–xZn (x = 10–40 wt%) Alloys in Borate Buffer Containing Chloride Ions

2005

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The electrochemical behaviour of Cu-xZn alloys and of Cu and Zn metals was studied by cyclic voltammetry and chronopotentiometry in borate buffer, pH = 9.2, with and without the addition of chloride ions in the range from 0.01 M to 1 M. In general, the shape of voltammograms of four Cu-xZn alloys with 10 -40 wt.% of zinc resembles that of copper more than that of zinc. With increasing zinc content several characteristics of zinc are observed. In borate buffer containing chloride anions, Cu-xZn alloys are susceptible to pitting corrosion. The breakdown potential, E b , at which the current density in the passive region starts to increase abruptly, becomes more negative with increasing zinc content in the alloy. The general relationship E b = a+b log c NaCl held in all cases, with constants a and b, however, being dependent on the zinc content of the alloy and on the chloride concentration. The corrosion resistance of Cu-xZn alloys was less than that of copper metal but significantly greater than that of zinc.

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“…The an odic dis so lu tion of bi nary al loys in dif fer ent aque ous en vi ron ments has been in ves ti gated un der a wide range of ex per i men tal con di tions [1][2][3][4][5][6] mainly fol low ing a dispute be tween se lec tive and si mul ta neous dis so lu tion processes of the com po nents. In this work, the dis so lu tion of com mer cial brass (60.8Cu-36.3Zn-2.9Pb) in 0.1 M HCl was in ves ti gated.…”

Section: Introductionmentioning

confidence: 99%

“…An un der stand ing of the al loy dis so lu tion mech a nism re quires knowl edge of such a pro cess for pure cop per. De spite the num ber of pub li ca tions on this subject [5][6][7][8] , the dis so lu tion of Cu-Zn al loys con tain ing Pb has not re ceived much at ten tion. The aim of this pa per is to obtain in for ma tion on the electrodissolution mech a nism of com mer cial brass in 0.1 M HCl, us ing cy clic voltammetry and a ro tat ing ring-disk elec trode.…”

Section: Introductionmentioning

confidence: 99%

The electrochemical behavior of brass in 0.1 M HCl solution

Geler¹,

Azambuja²

1997

J. Braz. Chem. Soc.

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Estudou-se a eletrodissolução de um latão comercial (60,9Pb) e do cobre em HCl 0,1 M usando a técnica de voltametria cíclica e eletrodo rotatório de disco e anel. O mecanismo de dissolução deste latão e do cobre apresentam diferentes parâmetros cinéticos. O mecanismo de dissolução do componente Cu da liga é análogo ao do cobre puro.The electrodissolution of com mer cial brass (60.8Cu-36.3Zn-2.9Pb) and pure cop per in 0.1 M HCl were com par a tively stud ied us ing cy clic voltammetry and a ro tat ing ring-disk electrode. The dis so lu tion mech a nism of both spec i mens pres ents dis tinct ki netic pa ram e ter s. How ever, the dis so lu tion mech a nism of the Cu com po nent of brass is the same as that ob serv ed for pure cop per. Key words: cop per dis so lu tion, ( α+β)-brass, ro tat ing ring-disk elec trode, voltammetry In tro duc tionThe an odic dis so lu tion of bi nary al loys in dif fer ent aque ous en vi ron ments has been in ves ti gated un der a wide range of ex per i men tal con di tions 1-6 mainly fol low ing a dispute be tween se lec tive and si mul ta neous dis so lu tion processes of the com po nents. In this work, the dis so lu tion of com mer cial brass (60.8Cu-36.3Zn-2.9Pb) in 0.1 M HCl was in ves ti gated. An un der stand ing of the al loy dis so lu tion mech a nism re quires knowl edge of such a pro cess for pure cop per. De spite the num ber of pub li ca tions on this subject 5-8 , the dis so lu tion of Cu-Zn al loys con tain ing Pb has not re ceived much at ten tion. The aim of this pa per is to obtain in for ma tion on the electrodissolution mech a nism of com mer cial brass in 0.1 M HCl, us ing cy clic voltammetry and a ro tat ing ring-disk elec trode. Ex per i men tal MethodA con ven tional three elec trode cell has been used. The elec tro chem i cal mea sure ments were made us ing a Cu disk (99.99% pure), and one of com mer cial brass (60.8Cu-36.3Zn-2.9Pb) with a 0.2 cm 2 ap par ent area as a work ing elec trode. Each elec trode was pol ished with emery pa per up to grade 600, and rinsed with al co hol and distilled wa ter. To de tect the for ma tion of sol u ble spe cies, dur ing the voltammetric sweep of the work ing elec trodes (Cu and brass) a ro tat ing ring-disk elec trode (RRDE) with a gold ring was used. The col lec tion ef fi ciency of the RRDE is N = 0.50 9 . For the de tec tion of the cuprous spe cies the ring po ten tial was fixed at 0.45 V vs. SCE, in which ox i dation to Cu(II) takes place. To de tect the Cu(II) spe cies, the ring po ten tial was set at -0.1 V vs. SCE. A sat u rated cal omel elec trode (SCE) was used as the ref er ence, and all poten tials were re ferred to this elec trode. A large area Pt wire, prop erly shielded, was used as the coun ter elec trode. The elec tro lyte so lu tions con sisted of 0.1 M HCl pre pared from an a lyt i cal grade re agents and twice dis tilled wa ter. Ex per iments were car ried out un der Ar gas sat u ra tion at 298 K. A bipotentiostat (EG&C, model 366) and a ro ta tor (EG&C, model 636) were em ployed for the mea sure ments. ...

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Electrochemical studies of the kinetics and mechanism of brass dezincification

Cited by 70 publications

References 5 publications

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Passivity and Corrosion of Cu–xZn (x = 10–40 wt%) Alloys in Borate Buffer Containing Chloride Ions

The electrochemical behavior of brass in 0.1 M HCl solution

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