A novel electroplating technique is proposed using simple and non-toxic aqueous solutions in contrast with conventional plating baths. The metal plating process consists of a two-step procedure, i.e., combination of well-known electrophoretic deposition (EPD) and electrochemical reduction. Initially, the EPD of metal oxide particles dispersed in pure water is performed so that an oxide layer can be formed on the electrode surface. The coating layer is then electrochemically reduced to the metallic state in a neutral electrolyte solution. Dissolution-precipitation of the oxide in the second step plays an important role in densification of the resultant metal film. This communication briefly discusses the electroplating mechanism and the effectiveness of the proposed technique.©2009 The Ceramic Society of Japan. All rights reserved.Key-words : Electroplating, Electrophoretic deposition, Electrochemical reduction, Dissolution-precipitation, Soft solution processing [Received April 10, 2009; Accepted July 16, 2009] Metal plating is a well known technique for coating a target material with a metallic film using a solution containing metal ions, and various coatings, such as pure metals, alloys and composite coatings, have been successfully manufactured to date. The major objective of metal plating is surface modification, which improves chemical durability, abrasion resistance, and aesthetic appearance of the target substrate. In general, metal plating is divided into three fields according to the driving force to reduce the metal ions in the plating bath; (1) electroplating under an applied cathodic potential, 1) (2) chemical (electroless) plating by addition of reducing agents, 2) and (3) displacement plating via partial substitution of desired metal for target surface. In order to fabricate fine, dense, smooth, and tough coating layers, the plating bath must contain a variety of additives besides metal salts, such as complexing, stabilizing, and buffering agents.3),4) In some cases, highly acidic or basic conditions are utilized. In other words, the metal plating bath is often a complex and toxic solution, implying the necessity for strict plating bath management.The present study proposes a novel electroplating method for the fabrication of metal layers using simple and non-toxic aqueous solutions. Metal plating by the proposed technique is carried out by a two step procedure, as schematically illustrated in Fig. 1. Initially, metal oxide particles are accumulated on the target surface by electrophoretic deposition (EPD) in an aqueous sol without additives. Subsequently, the oxide layer is electrochemically reduced to the metallic state in a neutral electrolyte solution. Therefore, the overall process is performed in aqueous media with a neutral pH range. Such a soft solution process 5) will become more important in the future, because this is a low energy process carried out under environmentally benign conditions. In this communication, we demonstrate that the proposed technique, based on a new principle, is...