Electrochemical study of the electroless copper plating process

Кузнецов, В. Н.; Golovtshanskaya, R.G.; Kruglikov, S. S.

doi:10.1016/0257-8972(86)90054-x

Cited by 4 publications

(6 citation statements)

References 2 publications

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“…The electrical current was also measured in these experiments. The rate of Cu deposition was converted to an equivalent current irea (in ~tA) by /red = (dcuAF)/(lO00 EWcu) [5] where dcu is the rate of Cu deposition from Fig. 3, A is the electrode area (0.34 cm2), F is the Faraday, and EWcu is the equivalent weight of Cu 2 § (31.773 g/equivalent).…”

Section: Resultsmentioning

confidence: 99%

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The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

Feldman

Melroy

1989

J. Electrochem. Soc.

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By simultaneously measuring the copper deposition rate and the current, we have determined the partial currents corresponding to the oxidative and reductive half-reactions for eleetroless Cu deposition from an EDTA, formaldehyde solution. These experiments were performed in a solution containing both copper and formaldehyde. The copper deposition rate was measured in situ with a quartz crystal microbalance. The resulting partial I/V curves are different from those obtained by others who used separated (one component missing) half-cells. Specifically, we find that formaldehyde catalyzes the electrochemical reduction of Cu(EDTA). These observations help explain discrepancies between previously measured I/V curves for the independent oxidative or reductive half-cells, and the predictions of mixed potential theory concerning the electroless Cu deposition rate.

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Section: Resultsmentioning

confidence: 99%

“…One of the most widely studied systems is based on Cu(EDTA) with formaldehyde as the reducing reagent in a basic (pH 10-12) solution. The reaction mechanism has been a subject of much debate for the last two decades (1)(2)(3)(4)(5). Mechanistic uncertainties stem from the complexity of the reaction and from inherent difficulties in studying it.…”

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confidence: 99%

The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

Feldman

Melroy

1989

J. Electrochem. Soc.

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“…Regarding the nature of Cu(III) entity, species ranging from CuOOH to Cu(III) radical have been proposed [24,25]. On the other hand, Cu(III) species can oxidise organic and biological compounds by chemical reaction(s) between these materials and Cu(III) species via a redox mediation electron transfer process (mediated electrocatalytic reaction, EC mechanism) at the anodic edge of the voltammograms in alkaline solutions [20,[24][25][26]. Based on this literature review, it can be deduced that atenolol was oxidised on n-MCPE surfaces via the active Cu(III) species.…”

Section: Resultsmentioning

confidence: 99%

“…In the entire range of potential window of aqueous electrolytes, different copper species are created, and the Cu(II)/Cu(III) redox transition performs at the anodic edge of the voltammograms in alkaline solutions [20][21][22][23]. Regarding the nature of Cu(III) entity, species ranging from CuOOH to Cu(III) radical have been proposed [24,25]. On the other hand, Cu(III) species can oxidise organic and biological compounds by chemical reaction(s) between these materials and Cu(III) species via a redox mediation electron transfer process (mediated electrocatalytic reaction, EC mechanism) at the anodic edge of the voltammograms in alkaline solutions [20,[24][25][26].…”

Section: Resultsmentioning

confidence: 99%

Simple template-free solution route for the synthesis of Cu(OH)₂and CuO nanostructures and application for electrochemical determination threeß-blockers

Mehdizadeh

Hasanzadeh

Sanati

et al. 2012

Journal of Experimental Nanoscience

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The synthesis of Cu(OH) 2 nanoparticles in a solution phase has been realised with high yield at low cost by simply dropping ammonia solution into an aqueous solution of CuCl 2 at ambient temperature. Furthermore, well-defined CuO nanostructures were produced by thermal dehydration of the as-prepared Cu(OH) 2 nanostructures in the solid state. Scanning electron microscopy (SEM), X-ray diffraction (XRD), and Fourier transform infrared (FT-IR) were used to characterise the products. The electrochemical behaviour of three ß-blocker drugs on copperoxide nanoparticle modified carbon paste electrodes was investigated. The modified electrodes showed excellent catalytic activity towards the oxidation of atenolol, carvedilol and propranolol in buffer solution. The linear concentration range of the proposed sensor for the atenolol, carvedilol and propranolol detection were 12-96, 5-37 and 10-104 mM, respectively.

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“…1 are indicative of the overall ELD rates. 62 A comparatively more complete method of measuring the ELD rate follows from the CV approach. The working principle of this method is based on the mixed potential theory, 63,64 and is similar to that of determining corrosion rates from corrosion currents obtained by Tafel extrapolation of CV-generated potentiodynamic polarization plots.…”

Section: Measurement Of Electroless Cu Deposition Ratesmentioning

confidence: 99%

Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds

Simpson

Johnson

Roy

2018

J. Electrochem. Soc.

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Due to its notable retention of electrical conductivity in nanoscale features, cobalt is a leading material candidate for diffusion barriers in the sub-14 nm node copper interconnects. In this application, Co also facilitates high aspect ratio gap-filling by serving as a substrate for direct electrochemical deposition (ECD) of Cu. However, the Co-Cu ECD system is associated with several technical challenges, which include dissolution of Cu seeds (and Co) in conventional acidic baths, interference of hydrogen evolution, and solution-sensitive nucleation barriers. We investigate here this ECD system by using pulsed galvanostatic ECD in a neutral plating bath of CuSO 4 , with in situ electroless deposition of Cu seeds. Both seeding and ECD of Cu are enhanced with the use of a carbon based catalytic activator. These observations are explained in terms of a proposed mixed-potential mechanism. Nucleation of the ECD-Cu is detected with voltammetry, and further quantified as an instantaneous step by measuring the associated kinetic parameters with chronoamperometry. Spatially uniform layers of pulse-deposited Cu on Co are detected by electron microscopy, and the deposition rates are determined using energy dispersed X-Ray spectroscopy. Corrosion tests performed in a glycine-based solution for Cu planarization confirm the general CMP compatible electrochemistry of the ECD-Cu.

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Electrochemical study of the electroless copper plating process

Cited by 4 publications

References 2 publications

The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

Simple template-free solution route for the synthesis of Cu(OH)₂and CuO nanostructures and application for electrochemical determination threeß-blockers

Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds

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Electrochemical study of the electroless copper plating process

Cited by 4 publications

References 2 publications

The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

The Mechanism of Electroless Cu Deposition: Extraction of the Oxidative and Reductive Electrochemical Half‐Cell Currents from a Complete Bath

Simple template-free solution route for the synthesis of Cu(OH)2and CuO nanostructures and application for electrochemical determination threeß-blockers

Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds

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Simple template-free solution route for the synthesis of Cu(OH)₂and CuO nanostructures and application for electrochemical determination threeß-blockers