1999
DOI: 10.1016/s1369-8001(99)00025-6
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Electrochemical synthesis of CuInSe2 for thin film devices

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Cited by 13 publications
(8 citation statements)
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“…The microstructure of the electrodeposited films, as deduced from SEM measurements (Fig. 1b), is typical of the electrodeposited CuInSe 2 films as already reported [15,16,17] regardless of both the substrate size (5 × 5 cm 2 or 30 × 30 cm 2 ) and the spotting shots (centre vs. edge of the substrates). The films are relatively porous with the presence of some spherical clusters (2-3 nm) at their surface; some of them being agglomerated leading to the typical cauliflower shape.…”
Section: Electrodeposited Precursorssupporting
confidence: 75%
“…The microstructure of the electrodeposited films, as deduced from SEM measurements (Fig. 1b), is typical of the electrodeposited CuInSe 2 films as already reported [15,16,17] regardless of both the substrate size (5 × 5 cm 2 or 30 × 30 cm 2 ) and the spotting shots (centre vs. edge of the substrates). The films are relatively porous with the presence of some spherical clusters (2-3 nm) at their surface; some of them being agglomerated leading to the typical cauliflower shape.…”
Section: Electrodeposited Precursorssupporting
confidence: 75%
“…These precursors can be designed with many properties in mind, including stoichiometry, solubility, and volatility. Our group has studied the synthesis of single-source precursors to CuInS 2 and CuInSe 2 , and the subsequent conversion of these precursors to thin-films of the bulk semiconducting materials. …”
Section: Introductionmentioning
confidence: 99%
“…These precursors can be designed with many properties in mind, including stoichiometry, solubility, and volatility. Our group has studied the synthesis of single-source precursors to CuInS 2 and CuInSe 2 , and the subsequent conversion of these precursors to thin films of the bulk semiconducting materials. The molecular precursor (PPh 3 ) 2 CuIn(SEt) 4 (Figure ) was first described by Hirpo et al in 1993 . This charge-neutral molecule comprises a copper(I) ion bound by two triphenylphosphine ligands, an indium(III) ion with two terminal ethanethiolate ligands, and two ethanethiolate ligands coordinated in a m 2-bridging manner between the metal centers.…”
Section: Introductionmentioning
confidence: 99%