Electrochemistry and Corrosion on Homogeneous and Heterogeneous Metal Surfaces

Smyrl, William H.

doi:10.1007/978-1-4757-4825-3_2

Cited by 12 publications

(15 citation statements)

References 46 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Generally, the high frequency capacitive loop corresponds to a Faradaic process involving a charge transfer resistance in parallel with double-layer capacitance element . It is well-known that the cathodic reaction of copper in oxygenated H 2 SO 4 solutions at E corr is oxygen reduction being the hydrogen discharge current density negligible as compared to oxygen reduction current density and the anodic reaction is copper dissolution . The presence of the Warburg impedance could be attributed to either the transportation of corrosive ions and soluble corrosion products at the metal/solution interface or the diffusion of dissolved oxygen from the bulk solution to the copper electrode surface. , However, it should be pointed out that the second one is more probable.…”

Section: Resultsmentioning

confidence: 99%

Electrochemical Study of Cyproconazole as a Novel Corrosion Inhibitor for Copper in Acidic Solution

Tao

Wang

et al. 2013

Ind. Eng. Chem. Res.

View full text Add to dashboard Cite

Cyproconazole (CPA) is an azole fungicide and easily biodegradable so that it is an alternative corrosion inhibitor in the water treatment and industrial pickling process. Effects of CPA on the corrosion resistance of copper in 0.5 M H2SO4 solutions were evaluated via electrochemical impedance spectroscopy (EIS), potentiodynamic polarization, and scanning electron microscopy (SEM). Both thermodynamic and adsorption models were calculated and discussed. The results showed that the adsorption of CPA on the copper surface obeys the Dhar–Flory–Huggins and Bockris–Swinkels substitutional adsorption isotherms. The number of water molecules (X) replaced by a molecule of organic adsorbate was determined from the different substitutional adsorption isotherms applied to the data obtained from EIS experiments.

show abstract

Section: Resultsmentioning

confidence: 99%

Electrochemical Study of Cyproconazole as a Novel Corrosion Inhibitor for Copper in Acidic Solution

Tao

Wang

et al. 2013

Ind. Eng. Chem. Res.

View full text Add to dashboard Cite

show abstract

“…These findings mean that the inhibitor molecules are adsorbed on both the anodic and cathodic sites, retarding both anodic dissolution and cathodic reduction reactions. For copper corrosion in aerated acidic solutions at E corr , the anodic reaction is copper dissolution and cathodic reaction is oxygen reduction being the hydrogen discharge current density negligible as compared to oxygen reduction current density [35]. More details concerning the electrochemical reactions for copper in HNO 3 solutions are present in our previous study [36].…”

Section: Tafel Polarization Measurementsmentioning

confidence: 99%

On the corrosion inhibition and adsorption behaviour of some benzotriazole derivatives during copper corrosion in nitric acid solutions: a combined experimental and theoretical study

2009

View full text Add to dashboard Cite

Copper corrosion inhibition in 1 M HNO 3 solution by some benzotriazole derivatives, namely N-(2-thiazolyl)-1H-benzotriazole-1-carbothioamide (TBC), N-(furan-2-ylmethyl)-1H-benzotriazole-1-carbothioamide (FBC) and N-benzyl-1H-benzotriazole-1-carbothioamide (BBC), was investigated by ac impedance, dc polarization and weight loss techniques. A significant decrease in the corrosion rate of copper was observed in presence of the investigated compounds. The corrosion rate was found to depend on the concentration and type of the inhibitor. The degree of surface coverage of the adsorbed inhibitor was determined by weight loss technique, and it was found that the results obeyed Langmuir adsorption isotherm. Tafel polarization data indicated that the three selected inhibitors were of mixed type. The reactivities of the compounds under investigation were analyzed through Fukui indices, derived from density functional theory (DFT), to explain their inhibition performance.

show abstract

“…Anodic Cu dissolution in aqueous solutions has been investigated in numerous studies because of its practical importance in Cu corrosion and electrorefinement as well as because of fundamental interest in electrochemical metal dissolution/ deposition reactions. 1 Most of these studies concentrated on the macroscopic kinetics of this process and its dependence on electrolyte composition and the effect of corrosion-inhibiting organic additives, such as benzotriazole (BTAH, C 6 H 4 N 3 H). For a better understanding of the underlying atomic scale processes, model studies have been performed on the dissolution of Cu single-crystal electrodes in pure acidic solutions using electrochemical and ex situ techniques [2][3][4] and, more recently, in situ scanning probe techniques, such as atomic force microscopy (AFM) 5,6 and scanning tunneling microscopy (STM).…”

Section: Introductionmentioning

confidence: 99%

In Situ STM Study of Cu(111) Surface Structure and Corrosion in Pure and Benzotriazole-Containing Sulfuric Acid Solution

et al. 1999

View full text Add to dashboard Cite

We present results of an in situ STM study on the surface structure and anodic dissolution of Cu(111) electrodes in pure 0.01 M H2SO4 solution and in solution containing the corrosion inhibitor benzotriazole (BTAH), which is aimed at an atomistic understanding of the dissolution process and the inhibitior effects. The initial stages of Cu dissolution as well as the adsorption of BTAH are pronouncedly influenced by the presence of the ordered sulfate adlayer, which forms in the double layer potential regime and induces a reconstruction of the underlying Cu surface layer, together with a reorientation of the steps along the close-packed lattice directions. Cu dissolution in pure H2SO4 solution proceeds by a step flow mechanism. The onset of dissolution is critically affected by the relative orientation of the sulfate adlayer on the lower terrace side, with the stability being highest for steps running perpendicular to the close-packed sulfate rows. The retracting steps often expose apparently disordered areas, which are attributed to a disordered sulfate adlayer on a Cu surface where, because of kinetic limitations, a well-ordered reconstruction has not yet reformed. BTAH adsorption is only observed in the potential regime of the ordered sulfate adlayer. The BTAH adlayer is highly defective, which is attributed to the removal of the reconstruction due to sulfate adlayer displacement. Islands with poorly ordered 1D chain structures are surrounded by areas with no resolved structure. Cu dissolution inhibition is manifested by an anodic shift in the onset of dissolution as well as by the blocking of the step flow etch mechanism, reflecting a stabilization of the Cu steps by adsorbed BTAH. Dissolution at higher potentials proceeds predominantly via formation of monolayer etch pits. When the potential is reversed back into the double layer regime, smoothening of the surface is observed with a rate that increases strongly with decreasing potential.

show abstract

Electrochemistry and Corrosion on Homogeneous and Heterogeneous Metal Surfaces

Cited by 12 publications

References 46 publications

Electrochemical Study of Cyproconazole as a Novel Corrosion Inhibitor for Copper in Acidic Solution

Electrochemical Study of Cyproconazole as a Novel Corrosion Inhibitor for Copper in Acidic Solution

On the corrosion inhibition and adsorption behaviour of some benzotriazole derivatives during copper corrosion in nitric acid solutions: a combined experimental and theoretical study

In Situ STM Study of Cu(111) Surface Structure and Corrosion in Pure and Benzotriazole-Containing Sulfuric Acid Solution

Contact Info

Product

Resources

About