Additively manufactured (AM) Tiā6Alā4V devices are implanted with increasing frequency. While registry data report shortāterm success, a gap persists in our understanding of longāterm AM Tiā6Alā4V corrosion behavior. Retrieval studies document Ī² phase selective dissolution on conventionally manufactured Tiā6Alā4V devices. Researchers reproduce this damage in vitro by combining negative potentials (cathodic activation) and inflammatory simulating solutions (H2O2āphosphate buffered saline). In this study, we investigate the effects of these adverse electrochemical conditions on AM Tiā6Alā4V impedance and selective dissolution. We hypothesize that cathodic activation and H2O2 solution will degrade the oxide, promoting corrosion. First, we characterized AM Tiā6Alā4V samples before and after a 48āh ā0.4āV hold in 0.1āM H2O2/phosphate buffered saline. Next, we acquired nearfield electrochemical impedance spectroscopy (EIS) data. Finally, we captured micrographs and EIS during dissolution. Throughout, we used AM Tiā29Nbā21Zr as a comparison. After 48āh, AM Tiā6Alā4V selectively dissolved. Tiā29Nbā21Zr visually corroded less. Structural changes at the AM Tiā6Alā4V oxide interface manifested as property changes to the impedance. After dissolution, the logāadjusted constant phase element (CPE) parameter, Q, significantly increased from ā4.75 to ā3.84 (Scmā2(s)Ī±) (pā=ā.000). The CPE exponent, Ī±, significantly decreased from .90 to .84 (pā=ā.000). Next, we documented a systematic decrease in oxide polarization resistance before pit nucleation and growth. Last, using kāmeans clustering, we established a structureāproperty relationship between impedance and the surface's dissolution state. These results suggest that AM Tiā6Alā4V may be susceptible to in vivo crevice corrosion within modular taper junctions.