Electrode surface coarsening in pulsating overpotential copper electrodeposition

Morphology and structure of bright electrodeposited metal coatings

“…It is evident from Figure 21 that there is noticeable upward trend in surface roughness with increase of deposition time, i.e. with the increase of coating thickness an increase of roughness occurs, which is consistent with the literature data [21,22]. From Figure 24 it is evident that with the brightener (levelers) it practically comes to a complete reduction of the amplitude of roughness (from several hundred nm to a few nm), leading to the specular brightness.…”

“…Figures 13 and 14 show backscattering SEM microphotographs of copper coating surfaces obtained from sulfate solution, without brightener, with thickness of 15 μm ( Figure 13) and 50 μm (Figure 14), respectively. As expected, increase in deposition time and coating thickness, leads to increase in roughness [21,22]. Figures 15 and 16 show SEM microphotographs of copper coating surfaces, with thickness of 15 μm and 50 μm, obtained from the electrolyte with brightener, respectively.…”

“…With increase in deposition time i.e. with increase in coating thickness, where the electrolyte is without additive, an increase in roughness is present (Figures 13 and 14), while in the presence of additive, copper coating, even with increasing thickness, becomes smoother and smoother (Figures 15 and 16) [21,22]. Figures 13 and 14 show backscattering SEM microphotographs of copper coating surfaces obtained from sulfate solution, without brightener, with thickness of 15 μm ( Figure 13) and 50 μm (Figure 14), respectively.…”

Electrodeposition of Cu from Acidic Sulphate Solutions in the Presence of PEG: An Electrochemical and Spectroelectrochemical Investigation – Part I

“…(b) Well-developed crystallites with overall geometries relating to cubic crystal symmetry appear at some points of the deposit, this kind of growth form is typical for activation-controlled electrodeposition [41,49]. Transition structures between cubic crystallites and needleshaped features exhibiting an extension of the cubic structures appear, such features have been reported in the literature for acidic sulphate Cu electrodeposition in the range of activation-controlled electrode kinetics [49]. (c) Needle-shaped dendrite precursors; these features are typical of overpotential conditions close to critical for dendrite development.…”

The Cathodic Polarization Curves in Electrodeposition of Metals

“…For example, the activation-controlled electrodeposition of copper produces large grains with relatively well-defined crystal shapes. This happens at overpotentials belonging to the region of the Tafel linearity [2,3]. At overpotentials that are between the end of the Tafel linearity and the beginning of the limiting diffusion current density plateau (the mixed activationdiffusion control), morphological forms are influenced by the mass transfer conditions, and large grains are not formed [4,5].…”