Electrodeposited CoPt films from a deep eutectic solvent

Guillamat, P.; Cortés, M.; Vallés, E.; Gómez, Elvira

doi:10.1016/j.surfcoat.2012.04.093

Cited by 47 publications

(26 citation statements)

References 29 publications

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“…Metal deposition from DES liquids is an area that has received increasing interest. A wide range of metals has been electrodeposited from deep eutectic solvents [7][8][9][10][11][12].…”

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confidence: 99%

First stages of silver electrodeposition in a deep eutectic solvent. Comparative behavior in aqueous medium

Sebastián¹,

Vallés²,

Gómez³

2013

Electrochimica Acta

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The aim of the present work was to study the viability of a deep eutectic solvent (DES) solvent (consisting in a eutectic mixture of 1 choline chloride: 2 urea) as electrolyte for the electrodeposition of silver (I), paying special attention to the influence of the liquid on the mechanism of nucleation process. As this DES solvent is rich in chloride anion, which can act as complexing agent of the silver cation, parallel analysis was made, as reference, in aqueous media, both in free-chloride solution and in excess of chloride.These studies were made to analyze the role of chloride anion on the first stages of silver electrodeposition, but also to compare as nucleation mechanism changes depending on the medium, especially when DES solvent was used. For all solutions, cyclic voltammetry was useful to establish the potential range at which silver electrodeposition occurred, while potentiostatic technique was used to study the mechanism of the process. In all media, the deposition follows a nucleation and three dimensional growth governed by diffusion. The viability of the nucleation mechanism by Scharifker-Hills model was demonstrated. The analysis of the rising parts of the j-t transients confirms the obtained results by the model. Diffusion coefficients of silver species present in the solution were calculated from linear regression of j vs t -1/2 at long deposition times. IntroductionIn the last decades, room temperature ionic liquids (RTIL) have been demonstrated as an interesting alternative to the aqueous solutions for metals electrodeposition due to their intrinsic ionic conductivity, low vapor pressure and wide electrochemical window [1,2]. However, eutectic mixtures obtained by mixing quaternary ammonium halides with hydrogen bond donors, as amides, carboxylic acids or alcohols [3-6], known as deep eutectic solvents (DES) are emerging as substitutes of RTIL because of its lower price and greater stability against oxygen and water. 2 urea [3] is the selected DES. In aqueous medium, both perchlorate and chloride solutions were used; Ag(I) solubilises easily in perchlorate medium and in concentrated chloride solution, the excess of chloride allows the solubilisation of low Ag(I) concentration by means of Ag(I) complexation [20,21]. This last situation is comparable to that found in the ionic liquid in which a rough calculation indicates that the chloride concentration would be the equivalent of about 5 M, higher than the sodium chloride in aqueous medium [22]. The silver deposition in DES and in aqueous solution containing or not chloride complexing anion is analysed and compared. ExperimentalChemicals used were silver nitrate from Panreac, sodium chloride and sodium perchlorate both from Merck, all of them of analytical grade. Aqueous solutions were prepared with water doubly distilled and then treated with a Millipore Milli-Q system and the pH was kept at 3. The DES solvent was prepared using choline chloride (from Across Organics) and urea (from Merck) of analytical grade. The solids, in the molar Aqueo...

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“…Metal deposition from DES liquids is an area that has received increasing interest. A wide range of metals has been electrodeposited from deep eutectic solvents [7][8][9][10][11][12].…”

mentioning

confidence: 99%

First stages of silver electrodeposition in a deep eutectic solvent. Comparative behavior in aqueous medium

Sebastián¹,

Vallés²,

Gómez³

2013

Electrochimica Acta

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“…In fact, there have been some reports on magnetic films such as Ni, Co, Ni-Co, Ni-Co-Sn, Sm-Co, and Co-Pt prepared from DESbased baths, [3][4][5][6][7][8][9][10] and we have also reported Fe and Fe-Ni films prepared in DES-based plating baths. 11,12 In our previous studies, we confirmed that the plating processes from the DES-based baths for the Fe and the Fe-Ni films have high current efficiency (>90%).…”

Section: Introductionmentioning

confidence: 62%

Magnetic Fe-Co films electroplated in a deep-eutectic-solvent-based plating bath

Yanai

Shiraishi

Watanabe

et al. 2015

Journal of Applied Physics

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We fabricated Fe-Co films from a deep eutectic solvent (DES)-based plating bath and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl 2 Á4H 2 O, and CoCl 2 Á6H 2 O. The composition of the plated films depended on the amount of FeCl 2 Á4H 2 O in the plating bath, and Fe content of the films was varied from 0 to 100 at. %. Depending on the Fe content, the saturation magnetization and the coercivity of the films varied. The Fe 76 Co 24 film shows high saturation magnetization and smooth surface, and the change in the saturation magnetization shows good agreement with the expected change by the Slater-Pauling curve. High current efficiency (>90%) could be obtained in the wide film composition. From these results, we concluded that the DES-based plating bath is one of effective baths for the Fe-Co films with high current efficiency. V C 2015 AIP Publishing LLC.

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“…3 Table 14 shows the conductivities observed in DESs which are comparable to ionic liquids; 44,45 DESs are therefore a highly investigated medium for electrochemical applications. [46][47][48][49][50][51][52][53][54][55][56][57][58][59][60][61][62][63] Readers interested in electrodeposition from ILs and DESs will find a good review in ref. 64.…”

Section: Molar Heat Capacities and Conductivitymentioning

confidence: 99%