In this work, the underpotential deposition of metals such as copper and lead during the electrochemical deposition of gold is investigated to understand the influence that the incorporation of a second metal has on the morphology of gold nanostructures. The incorporation of Pb or Cu, even at concentrations as low as 0.2 %, significantly influences the morphology of the deposit, where the formation of elongated structures from a central gold structure is favored. These nanostructures are characterized by cyclic voltammetry, X‐ray diffraction, scanning electron microscopy, and energy‐dispersive X‐ray spectroscopy and are tested for their suitability as a sensing layer for the electrochemical detection of nitrite ions in aqueous solution. A limit of detection of 0.3 μM is achieved with a linear range up to 1 mM, which is adequate for the determination of nitrite contained within food products.