Electrodeposition for the synthesis of microsystems

Abstract

Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.

Morphology and magnetic properties of electroplated Co-rich Co-Zn thin films

“…The outof-plane and in-plane hysteresis loops were measured using a vibrating sample magnetometer (ADE Technologies, EV9) with the maximum applied fields up to 800 kA/m (10 kOe). For comparison of the out-of-plane and in-plane magnetization curves, demagnetization corrections were performed on the out-of-plane data using the slope compensation method (O'Handley 2000). For completeness, both raw and demag-corrected magnetization curves are reported for the out-of-plane measurements.…”

“…Unlike evaporation or sputtering, electroplating requires relatively simple equipment and offers high film deposition rates. This provides a cost-effective method for depositing thick films for mass production (Ruythooren et al 2000).…”

Indentation behaviour of 'soft film on hard substrate' composite system type

“…An interesting approach for growing of metal and alloy layers is the use of electrochemical deposition technique. Electrochemical www.idk.org.rs/casopis deposition (ED) is fully compatible with MEMS technologies and has several advantages in comparison to another deposition processes: it is a lowtemperature deposition technique with easy-controlled high deposition rate that allows a wide thickness range, the easy control of thickness and residual stress, chemical composition of the layer and microstructure (grain size) of the deposits [4][5][6].…”

Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology

“…Photoresist molded [4] low-temperature metalelectroplating [5] technology, allowing the formation of films with thickness (hence structural height) not readily achievable using conventional surface micro-fabrication techniques, has been reported by Engelmann [6]. The processes and the materials employed in low-temperature electroplating of metals are largely compatible with active substrates.…”