Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays

Ma, Zhigao; Jiang, Bingyan; Dong, Yanzhuo; Qiang, Jun; Drummer, Dietmar; Zhang, Lu

doi:10.1039/d2cp05396a

Cited by 6 publications

(1 citation statement)

References 25 publications

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“…Similarly, increasing the cathode rotation speed also did not improve the filling ratio, as shown in figures 14(d) and (e). This may be because the aspect ratio is so high that the cathode rotation cannot accelerate the ion supplementation rate inside the microcavities [15,23]. Therefore, it is necessary to use other methods to enhance the supplementation efficiency.…”

Section: Experimental Verification Of Mass Transfer Controlling Factorsmentioning

confidence: 99%

Mass transfer characteristics at cathode/electrolyte interface during electrodeposition of nickel microcolumns with various aspect ratios

Dong,

Jiang,

Drummer

et al. 2023

J. Micromech. Microeng.

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The filling behaviour of electrodeposited microcolumns is strongly influenced by the mass transfer characteristics at the cathode/electrolyte interface. This study aims to elucidate the influence of the mass transfer characteristics (ion supplementation via diffusion and ion consumption via deposition) on the electrodeposition of microcolumns, thus providing feasible solutions for improving void defects with different feature sizes. The results indicate that ion consumption plays an important role in the mass transfer within large-width microcavities (100 μm). For large-width microcolumns, longer electroforming times lead to higher ion consumption, resulting in nonuniform ion concentration distribution, and consequently uneven deposition rates along the microcavity wall. In microcavities with high aspect ratio (5:1), ion supplementation plays a major role. The low ion supplementation rate does not support a uniform deposition, resulting in a large void defect and a low filling ratio in the deposited microcolumns. Therefore, reducing the ion consumption rate by decreasing the current density from 1 A/dm2 to 0.25 A/dm2 can effectively increase the filling ratio in large-width microcolumns with no significant effect on high aspect ratio microcolumns. On the contrary, the pulse reverse current (forward pulse current density 1 A/dm2, reverse pulse current density 2 A/dm2, frequency 1 Hz, forward pulse duty cycle 0.9) can increase the filling ratio in the high aspect ratio microcolumns by accelerating ion supplementation through dissolution of the deposited layer. By further increasing the reverse pulse current density from 2 A/dm2 to 6 A/dm2, void defects can be completely eliminated and even void-free deposition of high aspect ratio microcolumns (5:1) can be achieved.

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Section: Experimental Verification Of Mass Transfer Controlling Factorsmentioning

confidence: 99%

Mass transfer characteristics at cathode/electrolyte interface during electrodeposition of nickel microcolumns with various aspect ratios

Dong,

Jiang,

Drummer

et al. 2023

J. Micromech. Microeng.

Self Cite

View full text Add to dashboard Cite

show abstract

A new method for preparing ultra-large aspect ratio microcylindrical electrode array by EDM

Jin,

Gong,

Tan

et al. 2024

Arch. Civ. Mech. Eng.

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Electroforming of submillimeter scale array structures with a jet-flush mixed flow field

Shen

Zhu

et al. 2023

Journal of Manufacturing Processes

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Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays

Abstract: Due to the confined mass transfer capability in a microchannel, void defects are easily formed in the electroformed microcolumn array with a high depth/width ratio, which seriously affects the life and performance of micro-devices.

Cited by 6 publications

References 25 publications

Mass transfer characteristics at cathode/electrolyte interface during electrodeposition of nickel microcolumns with various aspect ratios

Mass transfer characteristics at cathode/electrolyte interface during electrodeposition of nickel microcolumns with various aspect ratios

A new method for preparing ultra-large aspect ratio microcylindrical electrode array by EDM

Electroforming of submillimeter scale array structures with a jet-flush mixed flow field

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