Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Huang, Jian; Liu, Weifei; Chen, Mingwei; Tang, Yunzhi; Fan, Xiaowei

doi:10.1016/j.jallcom.2024.178156

Journal of Alloys and Compounds

2024

DOI: 10.1016/j.jallcom.2024.178156

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Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Jian Huang,

Weifei Liu,

Mingwei Chen

et al.

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Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

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