Electrodeposition of Ag, Pd and Au on Ni monolayer islands on (1 × 1)-Au(111) by in-situ scanning tunneling microscopy

Lecadre, Florian; Maroun, Fouad; Allongue, P.

doi:10.1016/j.electacta.2016.02.124

Cited by 9 publications

(4 citation statements)

References 35 publications

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“…The activity is determined by the chemical composition of the surface and its electronic structure. [14][15][16][17][18][19] In a bimetallic system additional surface processes can take place, such as surface segregation, [20][21][22] which affects the chemical composition and, ultimately, the catalyst activity of the surface. Considering the catalyst stability, a catalyst can undergo corrosion, dissolution or various aggregation processes, which also can lead to an activity loss.…”

Section: Introductionmentioning

confidence: 99%

Lattice mismatch as the descriptor of segregation, stability and reactivity of supported thin catalyst films

Fako

Dobrota

Pašti

et al. 2018

Phys. Chem. Chem. Phys.

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Section: Introductionmentioning

confidence: 99%

Lattice mismatch as the descriptor of segregation, stability and reactivity of supported thin catalyst films

Fako

Dobrota

Pašti

et al. 2018

Phys. Chem. Chem. Phys.

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“…Surface alloying is a common surface phenomenon in metal-on-metal deposition involving elements like Co and Cu that are immiscible in the bulk phase. [40][41][42][43] Ultrahigh vacuum deposition studies of Co ultrathin films on Cu indicate segregation of Cu atoms to the surface of Co layers at room temperature. [43][44][45] In the inverse system, a structural analysis reveals that a pseudomorphic Cu film on Co(0001) grows layer-by-layer up to 4 monolayers before transitioning to three-dimensional growth.…”

Section: Discussionmentioning

confidence: 99%

Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte

Liu¹,

Brogan²,

Rigsby³

et al. 2022

J. Electrochem. Soc.

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Cu electroplating on an ultrathin Co seed has been developed for superconformal filling of advanced interconnects, in an acidic CuSO4 electrolyte containing plating additives, i.e., halide, suppressor, accelerator, and leveler. A suppressor-halide adlayer is found to play a bifunctional role in both suppressing Cu growth and inhibiting Co dissolution. Corrosion inhibition is attributed to adsorption of hydrophobic suppressor molecules on a halide-terminated Co surface that blocks water from interacting with Co, thereby retarding the formation of Co(OH)+, a corrosion immediate with which hydronium from the electrolyte would react to form soluble Co2+. With enhanced suppression, Co loss is mainly confined to the removal of native Co oxides in acid. Correspondingly, galvanic Cu deposition forms a monolayer shortly after immersion at open-circuit potential, becoming self-terminated with growth of a second layer over the next 20 s as dynamic surface processes make more underlying Co available for the displacement reaction. Growth of the first Cu layer is controlled by the receding of native oxides in an exponential-decay manner. Native Co oxides, if not removed, promote Cu protrusions in electroplating. The proposed process produces void-free fill on a 22 nm wide feature with a Co liner about 20 Å thick after fill.

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“…In order to complete this analysis, we performed a dedicated experiment to determine the potential at which holes form in a pure Ni monolayer: Ni monatomic islands were deposited on Au(111) and subsequently entirely surrounded by Au rims by electrodepositing Au at −1.05 V. The amount of Au sitting on top of the Ni islands was negligible. 53 In situ STM observations under quasi static conditions demonstrated (data not shown) that a potential of ∼−0.9 V must be applied to initiate a hole in the Ni terrace. This value is more positive than the dissolution onset potential of -0.98 V measured for Ni step edge atoms.…”

Section: (B) Ni Dissolution Potential As a Function Of The Local Atom...mentioning

confidence: 98%

Electrochemical de-alloying in two dimensions: role of the local atomic environment

2016

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We investigate by in situ scanning tunnelling microscopy (STM) the potential dependence of the electrochemical dealloying of NiPd monoatomic layers electrodeposited on Au(111). The dealloying process is achieved by Ni selective dissolution and was studied as a function of NiPd composition: for an alloy with a Ni content ≥70%, quasi-complete Ni dissolution is achieved at a potential of -0.9 VMSE whereas for a Ni content <70%, Ni dissolution at the same potential drastically slows down after the removal of small amounts of Ni. The alloy morphology at this "passivation state" is characterized by the presence of holes in the alloy monolayer with evidence for the Pd enrichment at the hole edges. These findings are confirmed by Monte Carlo simulations. Further Ni dissolution at passivation was achieved by applying more positive potentials which depend on the alloy composition. These results allowed us to determine the correlation between the Ni dissolution onset potential and the local Pd content.

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Electrodeposition of Ag, Pd and Au on Ni monolayer islands on (1 × 1)-Au(111) by in-situ scanning tunneling microscopy

Cited by 9 publications

References 35 publications

Lattice mismatch as the descriptor of segregation, stability and reactivity of supported thin catalyst films

Lattice mismatch as the descriptor of segregation, stability and reactivity of supported thin catalyst films

Superconformal Copper Electroplating on an Ultrathin Cobalt Seed in an Acidic Copper Sulfate Electrolyte

Electrochemical de-alloying in two dimensions: role of the local atomic environment

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