Electrodeposition of Copper

Abstract

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Electrodeposition of kesterite thin films for photovoltaic applications: Quo vadis?

“…This resulted in a decrease of phase segregation in the absorber, with an efficiency improvement from 0.8% to 3.2% . Copper is relatively inert in most plating solutions of other metals and is highly conductive, making it an excellent under‐layer for the following elements to be deposited . Other reported approaches for stack ordering are Zn/Cu/Sn and Sn/Cu/Zn , but no devices are reported from these alternative stacks.…”

Analysis of Electroplated Films Using Dual‐Beam FIB/SEM and TEM Techniques

“…Lowering the acid significantly improves the thickness uniformity and planarity of the electroplated copper layer, which is also of benefit in the chemical-mechanical planarization processes [11][12][13][14][15]. The main species of the electrolyte solutions are copper sulfate (CuSO 4 Á5H 2 O).…”

Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers

“…9 The composition of the bath was 100 g/L CuSO 4 .5H 2 O (Fisher Scientific), 270 g/L H 2 SO 4 (Fisher Scientific), and 0.1 g/L NaCl. A large area (70 cm 2 ) Cu foil counter electrode was used, which was placed at a distance of 10 cm from the working electrode.…”

“…Additive-free Cu electroplating baths were employed (which contained ppm-levels of chloride) because these baths are known to minimize stress in electroplated films. 9 Additives-containing electrolytes may be used after optimization of the plating conditions that provide minimal stress in thick deposits. The tape test results, even after aggressive cross-hatching, confirm the superior adhesion of thick (∼100 μm) electroplated Cu films to glass.…”