Electrodeposition of copper on Ru(0001) in sulfuric acid solution: Growth kinetics and nucleation behavior

Nucleation of Sn and Sn–Cu alloys on Pt during electrodeposition from Sn–citrate and Sn–Cu–citrate solutions

“…The formation of stable nuclei and their growth can be observed by monitoring the current and information on the rate of nucleation, the density of nuclei and the mechanism of growth can be obtained from the shape of the resulting current-time transient plots [12]. Chronoamperometry has been used to study the nucleation mechanisms of different metals such as Sn, Cu, Ni and Co and alloys such as CdTe, CoFe and Bi 2 Te 3 on different substrates [6,9,[13][14][15][16][17]. Torrent-Burgues et al [6] and Gomez et al [9] studied the electrodeposition of Sn from sulfuric acid solutions on carbon substrates by using chronoamperometric experiments and showed a linear dependence between current density and time, which they attributed to instantaneous nucleation followed by two-or threedimensional growth limited by diffusion.…”

Copper underpotential deposition on Ru quasi-single-crystal films

“…The charge density for the oxidation/dissolution of the first Cu-layer was found to be 600 ± 40 lC cm À2 . The group of Kelber et al [45][46][47] studied the growth kinetics and nucleation behaviour of Cu deposited on Ru(0 0 0 1) and polycrystalline Ru with X-ray photoelectron spectroscopy (XPS), and the influence of chloride and iodide on Cu deposition. Chloride was found to induce the formation of a Cu(I) species on top of Ru.…”

Effect of additives and pulse plating on copper nucleation onto Ru

“…Ruthenium, when used on top of a diffusion barrier such as TaN, is of considerable interest to replace Cu seed layer because of its physical properties [31][32][33]. In a previous paper, Zheng et al [32], showed how additives impact nucleation rate on Ru surfaces that had been pretreated only by immersion in HCl, without electrochemical reduction.…”