Electrodeposition of copper thin films from 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide

Solvation of AgTFSI in 1‐ethyl‐3‐methylimidazolium bis(trifluoromethylsulfonyl)imide ionic liquid investigated by vibrational spectroscopy and DFT calculations

“…Recently, we have investigated the electrodeposition of copper and silver thin films using as electrolyte solutions of Cu(TFSI) 2 and silver bis(trifluoromethylsulfonyl)imide salt (AgTFSI) in 1‐ethyl‐3‐methyl‐imidazolium TFSI [EMI][TFSI], respectively . In both IL‐based electrolytes, the metal salt shares the TFSI anion with the IL.…”

Control of ferromagnetic properties of Ni80Fe20 thin films by voltage-induced oxidation

“…The increased current density in the forward scan direction is due to the oxidation at the interface between the 1-ethyl-3-methylimidazolium [EMIM] group and the permalloy film, while the increase in the current density on the reverse scan is due to reduction of the interfacial species created in the forward scan. 25 The ECW of EMIMTFSI is the potential range where there is no oxidation or reduction, i.e., inert within this potential range (defined here as where the absolute current density, jJj does not exceed 1 mA.cm À2 )a n d was calculated by subtracting the reduction potential limit from the oxidation potential limit. 23,25,26 The value of 4.4 V obtained for the ECW width here is in agreement with previous measurements.…”

“…25 The ECW of EMIMTFSI is the potential range where there is no oxidation or reduction, i.e., inert within this potential range (defined here as where the absolute current density, jJj does not exceed 1 mA.cm À2 )a n d was calculated by subtracting the reduction potential limit from the oxidation potential limit. 23,25,26 The value of 4.4 V obtained for the ECW width here is in agreement with previous measurements. 23,25 In a further CV study where the applied voltage was only cycled between positive voltages and 0 V (no negative voltages), the current peak at þ2.6 V was only present in the first cycle, which indicated a saturation of the oxidation process.…”

Sn‐Based Alloys Synthesized in an Ionic Liquid at Room Temperature: Cu6Sn5 as a Case Study

“…To control the chemical composition of Sn‐based alloys, we proposed to use metallic precursors based on TFSI − counter ions dissolved in an [EMIm + ][TFSI − ] ionic liquid. The use of common anion for both metallic precursors and the ionic liquid was shown to be an effective approach to (i) increase the solubility of cations in ILs, especially as compared to conventionally used halide salts, (ii) prevent impurities related to Cl − anions and (iii) enable the successful synthesis of nanosized metals . We selected the tin‐copper system and particularly the Cu 6 Sn 5 chemical composition for its possible use as an anode for lithium‐ion batteries.…”

“…The use of common anion for both metallic precursors and the ionic liquid was shown to be an effective approach to (i) increase the solubility of cations in ILs, [6,7] especially as compared to conventionally used halide salts, [8] (ii) prevent impurities related to Cl À anions [7] and (iii) enable the successful synthesis of nanosized metals. [6,7,9,10] We selected the tin-copper system and particularly the Cu 6 Sn 5 chemical composition for its possible use as an anode for lithium-ion batteries. We compared the synthesis employing TFSI À based precursors with conventionally used chloride salts.…”