Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

Shao, Wenbo; Sun, Yunkai; Zangari, Giovanni

doi:10.3390/coatings11121563

Cited by 10 publications

(8 citation statements)

References 62 publications

(88 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Despite the complications in its derivations (see Appendix A and Appendix D of this commentary), the mean-field solution of the potentiostatic transient from growing nuclei formed at the same time shows a good agreement with the instantaneous mode of the S-H model. 6 However, as observed in our works, the S-H model cannot satisfactorily explain the potentiostatic transients 7 and the spatial distribution 7,8 of electrodeposited Cu-Ag grains. Recently, Ustarroz et al observed that the nucleation and growth can follow "nonclassical" pathways via aggregation of existing nuclei, instead of the concept of nucleation exclusion zones.…”

contrasting

confidence: 56%

Commentary and Notes on the Original Derivations of the Scharifker-Hills Model

Sun

Zangari

2023

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

The Scharifker-Hills (S-H) model for the potentiostatic transients is one of the most widely utilized model in electrodeposition. With the concept of diffusion zones and the Kolmogorov-Johnson-Mehl-Avrami (KJMA) model, the occurrence of a peak current in the potentiostatic transient was elucidated. Unfortunately, the derivations of the S-H model had been scattered among several original papers. Herein, we have summarized the S-H model into the framework of the diffusion zone problem and compared the S-H model with the Classical model, the Scharifker and Mostany (S-M) model, the approach by Sluyters-Rehbach et al. (the SRWBS model), and the Heerman-Tarallo/Mirkin-Nilov (H-T/M-N) model.

show abstract

contrasting

confidence: 56%

Commentary and Notes on the Original Derivations of the Scharifker-Hills Model

Sun

Zangari

2023

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

show abstract

“…The experimental data used in this paper is from the dataset of our previous works [65][66][67] with the potentiostatic transients from our previous work [65]. Before deposition, the n-Si(001) wafer pieces (heavily-doped, resistivity < 0.005 Ω⋅cm) were cleaned in methylene chloride, acetone, and ethanol for 20 min in each step, and then etched in 30% HF solution for 2 mins, followed by rinsing in Milli-Q water.…”

Section: Methodsmentioning

confidence: 99%

Estimated and observed nucleation densities of electrodeposited Cu and Cu-Ag particles at n-Si(001) substrate

Sun,

Zangari

2023

Preprint

Self Cite

View full text Add to dashboard Cite

We have examined the particle density of electrodeposited Cu and Cu-Ag particles from acidic sulfate bath. Based on the potentiostatic transients, the nucleation densities of the deposits were estimated with the Scharifker-Hills model, the Scharifker-Mostany model, the Heerman-Tarallo model, the approach proposed by Sluyters-Rehbach et al., and the model based on the roughness of the planar diffusion field from the one-point correlation function. All the fitted nucleation densities significantly underestimate the particle density observed under SEM. The average grain size suggests that all the nuclei are growing with respect to time. Those behaviors suggest that the coalescence of the diffusion fields occurs much earlier than the full coalescence of the nucleation exclusion zones. Furthermore, we have also attempted to explain the observed nucleation densities with the surface defect density of heavily-doped n-Si(001) substrate and the volume of the electrolyte required for forming the critical nucleus of Cu or Ag. The assumption that the Cu(II) species are immediately consumed at the substrate has been justified, from which a characteristic time is proposed to evaluate the impact of the rate of concentration drop on the mass-transfer behavior of the system.

show abstract

“…The Scanning Electron Microscopy (SEM) images used in this paper are from the dataset of our previous works [28][29][30]. A heavily As-doped H-terminated n-Si(001) wafer with a resistivity < 0.005 Ω • cm (Silicon Quest International, San Jose, CA, USA) was cut and then cleaned with methylene chloride, acetone, and ethanol.…”

Section: Methodsmentioning

confidence: 99%

Observation of Weibull, Lognormal, and Gamma Distributions in Electrodeposited Cu and Cu-Ag Particles

Sun,

Zangari

2023

Materials

Self Cite

View full text Add to dashboard Cite

In this work, the nearest-neighbor distances and Voronoi cell features of Cu-Ag deposits were analyzed and fitted with Lognormal, Weibull, and Gamma distributions. The nearest-neighbor distance distributions of the samples were compared with those of complete spatially random points, showing spatial inhomogeneity due to the nucleation exclusion effect. The radial distribution function was calculated, showing both influences from the grain size and the nucleation exclusion effect. Voronoi cells were generated based on the shape of the grains. The size, occupancy, and coordination of the Voronoi cells were examined and fitted. The results show that although the Cu-Ag deposits seemed to be governed by the instantaneous nucleation mode, the spatial distribution of the nuclei was more impacted by the nucleation exclusion effect than the Cu-only samples. This behavior is also justified by the grain size distribution generated with Voronoi cell size and occupancy distributions.

show abstract

Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates

Cited by 10 publications

References 62 publications

Commentary and Notes on the Original Derivations of the Scharifker-Hills Model

Commentary and Notes on the Original Derivations of the Scharifker-Hills Model

Estimated and observed nucleation densities of electrodeposited Cu and Cu-Ag particles at n-Si(001) substrate

Observation of Weibull, Lognormal, and Gamma Distributions in Electrodeposited Cu and Cu-Ag Particles

Contact Info

Product

Resources

About