Electrodeposition of Cu–In alloys from a choline chloride based deep eutectic solvent for photovoltaic applications

Malaquias, João; Steichen, Marc; Thomassey, Matthieu; Dale, Phillip J.

doi:10.1016/j.electacta.2013.04.068

Cited by 55 publications

(47 citation statements)

References 25 publications

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“…6 This opposing behavior strongly indicates that there is no formation of intermetallic compounds in the system under study, in agreement with the In-Ga binary phase diagram. The nucleation loops and limiting currents are still observed.…”

Section: Electrochemical Study Of Chcl : U-gacl 3 -Incl 3 On Mosupporting

confidence: 71%

“…5,6 Table 1). In CV (a), corresponding to a ChCl : U-InCl 3 solution, a cathodic current at E = À0.65 V (c 1 ) and an anodic peak (a 1 ) at E = À0.10 V are recorded.…”

Section: Electrochemical Study Of Chcl : U-gacl 3 -Incl 3 On Momentioning

confidence: 99%

“…5,6 In this work, the DES Choline Chloride : Urea (ChCl : U -1 : 2) is used to deposit Cu-In-Ga (with individual plating efficiencies above 85%) 5,6 in a two-step process: first copper is electrodeposited onto Mo (from ChCl : U) and then indium and gallium are co-deposited onto it. 5,6 In this work, the DES Choline Chloride : Urea (ChCl : U -1 : 2) is used to deposit Cu-In-Ga (with individual plating efficiencies above 85%) 5,6 in a two-step process: first copper is electrodeposited onto Mo (from ChCl : U) and then indium and gallium are co-deposited onto it.…”

Section: Introductionmentioning

confidence: 99%

“…5,6 The Ga/III ratio of the film will depend on the concentration of the metal ions in solution. The diffusion coefficient of In 3+/0 and Ga 3+/0 is 3.4 Â 10 À8 cm 2 s À1 and 8.4 Â 10 À8 cm 2 s À1 , respectively at T = 60 1C.…”

Section: Introductionmentioning

confidence: 99%

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Tuning the gallium content of metal precursors for Cu(In,Ga)Se2 thin film solar cells by electrodeposition from a deep eutectic solvent

Malaquias

Regesch

Dale

et al. 2014

Phys. Chem. Chem. Phys.

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Controlling the Ga incorporation of Cu-In-Ga metal precursors for Cu(In,Ga)Se2 (CIGS) solar cells is one of the main challenges for low cost electrodeposition processes, mainly due to the difficulty in electrodepositing metallic Ga from aqueous electrolytes. In this work we use the deep eutectic solvent (DES) Choline Chloride : Urea (ChCl : U - 1 : 2) to efficiently codeposit In-Ga on Cu and Mo electrodes. We control the Ga/(Ga+In) (Ga/III) ratio of the films via the mass fluxes. The electrochemical behavior of ChCl : U containing GaCl3 and InCl3 is studied by rotating disk electrode cyclic voltammetry (CV) on Mo and Cu electrodes. CV revealed on both Mo and Cu electrodes that the electrochemical behavior of the ChCl : U-GaCl3-InCl3 system is the superposition of the individual In and Ga electrochemistry. On a Cu electrode the morphology, crystal structure and element distribution of the deposits were a function of the Ga/III ratio. We demonstrate the precise control of Ga incorporation over a large composition range from 0.1 ≤ Ga/III ≤ 0.9 and proved that ED from DES is a straightforward, robust and efficient process. First solar cells based on Mo/Cu/In-Ga metal stacks achieved efficiencies as high as 7.9% with a Voc of 520 mV.

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Section: Electrochemical Study Of Chcl : U-gacl 3 -Incl 3 On Mosupporting

confidence: 71%

“…5,6 Table 1). In CV (a), corresponding to a ChCl : U-InCl 3 solution, a cathodic current at E = À0.65 V (c 1 ) and an anodic peak (a 1 ) at E = À0.10 V are recorded.…”

Section: Electrochemical Study Of Chcl : U-gacl 3 -Incl 3 On Momentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Tuning the gallium content of metal precursors for Cu(In,Ga)Se2 thin film solar cells by electrodeposition from a deep eutectic solvent

Malaquias

Regesch

Dale

et al. 2014

Phys. Chem. Chem. Phys.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Choline chloride (2-hydroxyethyl)trimethylammonium chloride, ChCl) as a quaternary ammonium salt is widely applied to metal [8] and alloy electrodeposition [9][10][11][12][13][14][15][16][17][18][19] in the form of deep eutectic solvents (DESs) [20][21][22]. However, relatively low attention was received in metal electroless deposition from ChCl-based DESs [23,24].…”

Section: Introductionmentioning

confidence: 99%