Electrodeposition of Iron, Copper and Nickel Alloys from Cyanide Solutions—Part I

Stout, Lawrence E.; Faust, Charles L.

doi:10.1149/1.3497878

Cited by 4 publications

(2 citation statements)

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“…Cu(I) + e---~ Cu ~ [4] ~ 50 4O o 3o Ni(II) + 2e ---> Ni ~ [5] Ni(II) + e --~ Ni(I) [6] 20 10 Ni(I) + e --> Ni ~ [7] 0 2H20 + 2e---> H2 + 2 OH- [8] Additional chemical reactions which can occur at the electrode surface during or after the reduction reaction include Ni(II) ...... O ---> NiO [9] Cu(I)---O ---Cu(I) ---> Cu20 [10] Cu(II) + 2 OH--> Cu(OH) [11] Ni(II) + 2 OH---> Ni(OH) [12] Cu(I) ..... C1 ---> CuC1 [13] C1 ..... Cu(II) ..... C1 --> CuC12 [14] C1 ..... Ni(II) ..... C1 --> NiCt2 [15] The nature of the actual species undergoing reduction or compound formation in Eq. 2-15 is not clear.…”

Section: Cu(ii) + E--~ Cu(i) [3] < 60mentioning

confidence: 99%

Electrodeposition of Metal Alloy and Mixed Oxide Films Using a Single‐Precursor Tetranuclear Copper‐Nickel Complex

Dubé

Workie

Kounaves

et al. 1995

J. Electrochem. Soc.

139

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Electroreduction of heterotetranuclear complexes (~4-O)L~Cu4_~Ni~(H20)=C16 (x = 1-4, L = N,N-diethylnicotinamide) at a Pt electrode in dimethylsulfoxide leads to deposition of Cu-Ni alloys with codeposition of Cu(I) oxide, Ni(II) oxide, and Ni(II) hydroxide. The alloy deposition potential is invariant with complex stoichiometry. Alloy Ni composition, determined by x-ray diffraction (XRD), increases from 12% for x = 1 to 62% for x = 4. The microscopically rough, well-adhering, continuous films have a natural passivation layer formed by air oxidation that consists of Ni(OH)2, NiO, Cu(OH)2, and Cu20. X-ray photoelectron spectroscopy confirmed the bulk film alloy compositions obtained by XRD. The data revealed complex deposit structures consisting of NiO, Ni(OH)2, Cu20, and Cu-Ni alloy giving a mass balance of the metals in the complexes. The Cu20/Cu ~ ratio is close to unity for the deposit made from the Cu4 complex and decreases to zero for the CuNi3 complex. In contrast only half of the Ni(II) centers are deposited as Ni ~ in the Cu-Ni alloy, the balance consisting of 37% NiO and 15% Ni(OH)2. The constant percentage of Ni as Ni(OH)2 in all deposits suggests that it arises from reduction of Ni coordinated water. Mass balance indicates O in Cu20 and NiO originates from the ~4-O. Smooth variations of alloy compositions, metal oxide/metal ratios, and film particle sizes indicate that all the electrode processes involve discrete molecules of the heteropolymetallic complex.

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Section: Cu(ii) + E--~ Cu(i) [3] < 60mentioning

confidence: 99%

Electrodeposition of Metal Alloy and Mixed Oxide Films Using a Single‐Precursor Tetranuclear Copper‐Nickel Complex

Dubé

Workie

Kounaves

et al. 1995

J. Electrochem. Soc.

139

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“…standard electrode potentials of copper and nickel are nearly 600 mV apart, the metal ions are complexed with a ligand in order to codeposit the two metals more readily. Over the years, several complexing agents such as cyanide (8), oxalate (9), tartrate (10), citrate (11)(12)(13), pyrophosphate (14,15), and more recently, glycine (16) and L-asparagine (17) have been tried. Citrate and pyrophosphate plating baths thus far appear to be the most promising ones.…”

mentioning

confidence: 99%

Electrodeposition of Copper‐Nickel Alloys from Citrate Solutions on a Rotating Disk Electrode: I . Experimental Results

Ying

1988

J. Electrochem. Soc.

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Steady-state polarization measurements on stationary and rotating disk electrodes were performed in Cu-Ni-citrate plating baths as well as in single metal ion-citrate solutions. The polarization curves were used to identify the different electrode reactions occurring during the plating process. Five electrochemical reactions were found dominant in different potential regions. They were the reduction of hydrogen ion from the dissociation of hydrogenated citrate ion, oxygen reduction, copper deposition, nickel deposition, and reduction of water. C odeposition of Cu-Ni alloy occurred in a fairly narrow electrode potential region (-1.0 to -1.2V vs. SCE), where the effects of the side reactions were relatively small. A Levich analysis of the rotating disk data was used to determine the overall kinetic and mass transport parameters of the Cu-Ni alloy electrodeposition process. Finally, compositional and morphological analyses of the alloy plated at constant potentials were also performed.

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Elektrolytische Abscheidung von Kupfer‐Nickel‐Eisen‐Legierungen

Paweck

Bauer

Dienbauer

1934

Zeitschrift für Elektrochemie und angewandte physikalische Chem

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Electrodeposition of Iron, Copper and Nickel Alloys from Cyanide Solutions—Part I

Cited by 4 publications

References 0 publications

Electrodeposition of Metal Alloy and Mixed Oxide Films Using a Single‐Precursor Tetranuclear Copper‐Nickel Complex

Electrodeposition of Metal Alloy and Mixed Oxide Films Using a Single‐Precursor Tetranuclear Copper‐Nickel Complex

Electrodeposition of Copper‐Nickel Alloys from Citrate Solutions on a Rotating Disk Electrode: I . Experimental Results

Elektrolytische Abscheidung von Kupfer‐Nickel‐Eisen‐Legierungen

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