Electrodeposition of nanocrystalline copper thin films from 1-ethyl-3-methylimidazolium ethylsulphate ionic liquid

Liu, Tomin; Vilar, R.; Eugénio, S.; Grondin, Joseph; Danten, Y.

doi:10.1007/s10800-013-0630-6

Cited by 16 publications

(6 citation statements)

References 14 publications

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“…Electrochemical behavior of polycrystalline Cu, CuCl, and CuCl 2 in ionic liquid media has been carefully studied for advancing Cucoating technologies. [24][25][26][27][28] Generally, the use of CuCl produces a pair of reduction and oxidation peaks, corresponding to the Cu + -to-Cu 0 and Cu 0 -to-Cu + reactions respectively, while the use of CuCl 2 generates two pairs of oxidation and reductions peaks which are associated with the interconversion of Cu 2+ , Cu + and Cu. 26 It is generally considered that direct two-electron reduction of Cu 2+ into elemental Cu is kinetically hindered.…”

Section: Resultsmentioning

confidence: 99%

Copper-Assisted Etching of Gold through Electrochemical Deposition and Dissolution of Copper in Ionic Liquids

Jiang

2019

J. Electrochem. Soc.

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A novel green-chemistry process for etching polycrystalline gold has been successfully developed by tuning electrochemical deposition and dissolution of metallic copper onto and away from gold in an ionic liquid bath based on a copper assisted etching mechanism. During the cathodic reduction of Cu from CuCl 2 dissolved in the ionic liquid, the interaction of the electrodeposited Cu layer and the gold substrate leads to not only the formation of interfacial Cu-Au alloy intermediates but also the diffusion of Au into the Cu layer. During the subsequent anodic oxidation of Cu, the Au components in both the intermediates and the Cu layer are removed from the Au substrate, resulting in its etching. Cyclic voltammograms of CuCl 2 on the Au electrode in 1-ethyl-3-methylimidazolium chloride in the potential range of approximately −1.50 to 0.60 V vs a silver pseudo reference electrode, exhibit the reduction and oxidation peaks associated with the redox couples of copper species. Scanning-electron-microscope studies of the samples treated in the CuCl 2 -containing ionic liquid by potential cycles clearly demonstrate the etching of the Au substrate. Elemental X-ray diffraction analyses of the etched Au substrate reveal that there is no detectable Cu residue in the etched substrate. Furthermore, our calculation suggests that the Cu assisting method can obtain an etching rate of approximately 105 nm/min, favorably comparable to those of several dry and wet etching methods.

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Section: Resultsmentioning

confidence: 99%

Copper-Assisted Etching of Gold through Electrochemical Deposition and Dissolution of Copper in Ionic Liquids

Jiang

2019

J. Electrochem. Soc.

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“…In particular, insitu Scanning Probe Microscope (SPM) is a powerful method for electrodeposition studies in ILs to reveal morphological changes of the substrate surface at the atomic level [15][16][17][18]. The copper electrodeposition in ILs has also been investigated using several ex-situ techniques: SEM [2,19,28,[20][21][22][23][24][25][26][27], TEM [19,29,30], and XRD [20][21][22]31], although there is a report of in-situ STM [15]. It has been reported that the surface roughness of the electrode increased with repeated cathodic deposition and anodic dissolution of copper in 1-etyl-3methylimidazolium chloride (C 2mimCl) at 140 °C [28].…”

Section: Introductionmentioning

confidence: 99%

In-situ electrochemical SPR study of gold surface smoothing by repetitive cathodic deposition and anodic dissolution of copper in an ionic liquid

Ezawa

Nishi

Sakka

2020

Journal of Electroanalytical Chemistry

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“…Recently, we have investigated the electrodeposition of copper and silver thin films using as electrolyte solutions of Cu(TFSI) 2 and silver bis(trifluoromethylsulfonyl)imide salt (AgTFSI) in 1‐ethyl‐3‐methyl‐imidazolium TFSI [EMI][TFSI], respectively . In both IL‐based electrolytes, the metal salt shares the TFSI anion with the IL.…”

Section: Introductionmentioning

confidence: 99%

Solvation of AgTFSI in 1‐ethyl‐3‐methylimidazolium bis(trifluoromethylsulfonyl)imide ionic liquid investigated by vibrational spectroscopy and DFT calculations

Liu

Danten

Grondin

et al. 2015

J Raman Spectroscopy

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In this paper we investigate the solvation of silver bis(trifluoromethylsulfonyl)imide salt (AgTFSI) in 1‐ethyl‐3‐methylimidazolium TFSI [EMI][TFSI] ionic liquid by combining Raman and infrared (IR) spectroscopies with density functional theory (DFT) calculations. The IR and Raman spectra were measured in the 200–4000 cm−1 spectral region for AgTFSI/[EMI][TFSI] solutions with different concentrations ([AgTFSI] <0.2 mole fraction). The analysis of the spectra shows that the spectral features observed by dissolution of AgTFSI in [EMI][TFSI] solution originate from interactions between the Ag+ cation and the first neighboring TFSI anions to form relatively stable Ag complexes. The ‘gas phase’ interaction energy of a type [Ag(TFSI)3]2− complex was evaluated by DFT calculations and compared with other interionic interaction energy contributions. The predicted spectral signatures because of the [Ag(TFSI)3]2− complex were assessed in order to interpret the main IR and Raman spectral features observed. The formation of such complexes leads to the appearance of new interaction‐induced bands situated at 753 cm−1 in Raman and at 1015 and 1371 cm−1 in IR, respectively. These specific spectral signatures are associated with the ‘breathing’ mode and the S–N–S and S–O stretching modes of the TFSI anions engaged in the complex. Finally, all these findings are discussed in terms of interaction mechanisms enabling the electrodeposition characteristics of silver from AgTFSI/[EMI][TFSI] IL‐based electrolytic solutions. Copyright © 2015 John Wiley & Sons, Ltd.

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Electrodeposition of nanocrystalline copper thin films from 1-ethyl-3-methylimidazolium ethylsulphate ionic liquid

Cited by 16 publications

References 14 publications

Copper-Assisted Etching of Gold through Electrochemical Deposition and Dissolution of Copper in Ionic Liquids

Copper-Assisted Etching of Gold through Electrochemical Deposition and Dissolution of Copper in Ionic Liquids

In-situ electrochemical SPR study of gold surface smoothing by repetitive cathodic deposition and anodic dissolution of copper in an ionic liquid

Solvation of AgTFSI in 1‐ethyl‐3‐methylimidazolium bis(trifluoromethylsulfonyl)imide ionic liquid investigated by vibrational spectroscopy and DFT calculations

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