Electrodeposition of nickel from DES on aluminium for corrosion protection

Bernasconi, Roberto; Magagnin, Luca

doi:10.1080/02670844.2016.1175786

Cited by 29 publications

(16 citation statements)

References 24 publications

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“…In the case of nickel, different structures were found depending on both the DES composition and substrates employed. [38][39][40][41][42][43][44][45][46][47] Recently, Ustarroz et al investigated the nickel deposition on glassy carbon using a ChCl/urea based DES and described that nickel deposition involved the formation of nanostructures. 48 Here, we investigated in detail the electrodeposition of nickel in a DES based on the mixture ChCl/urea.…”

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confidence: 99%

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

Sebastián

Giannotti

Gómez

et al. 2018

ACS Appl. Energy Mater.

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The first steps of nickel electrodeposition in a deep eutectic solvent (DES) are analysed in detail. Several substrates from glassy carbon to Pt(111) were investigated pointing out the surface sensitivity of the nucleation and growth mechanism. For that, cyclic voltammetry and chronoamperometry, in combination with scanning electron microscopy (SEM), were employed. X-ray diffraction (XRD) and atomic force microscopy (AFM) were used to more deeply analyse the Ni deposition on Pt substrates.In a 0.1 M NiCl 2 + DES solution (at 70ºC), the nickel deposition on glassy carbon takes place within the potential limits of the electrode in the blank solution. Although, the electrochemical window of Pt|DES is considerably shorter than on glassy carbon|DES, it was still sufficient for the nickel deposition. On Pt electrode, the negative potential limit was enlarged while the nickel deposit growed, likely because of the lower catalytic activity of the nickel towards the reduction of the DES. At lower overpotentials, different hydrogenated Ni structures were favoured, most likely because of the DES co-reduction on the Pt substrate. Nanometric metallic nickel grains of rounded shape were obtained in any substrate, as evidenced by the FE-SEM. Passivation phenomena, related to the formation of Ni oxide and Ni hydroxylated species, were observed at high applied overpotentials. At low deposited charge, on Pt(111) the AFM measurements showed the formation of rounded nanometric particles of Ni, which rearranged and formed small triangular arrays at sufficiently low applied overpotential (Scheme 1). This particle pattern was induced by the <111> orientation and related to surface sensitivity of the nickel deposition in DES. The present work provides deep insights into the Ni electrodeposition mechanism in the selected deep eutectic solvent. Scheme 1. Representation of the Ni(II) electrodeposition in DES on Pt(111) and AFM image (2 x 2 µm 2 ) of the Ni clusters.

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confidence: 99%

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

Sebastián

Giannotti

Gómez

et al. 2018

ACS Appl. Energy Mater.

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“…The use of DES-based electrolytes can allow the deposition on aluminium or magnesium without specific pretreatments. This was demonstrated by Abbott et al [22], Florea et al [67] and Bernasconi et al [68] in the case of nickel on aluminum and by Bakkar et al [34] in the case of zinc on magnesium. Compact metallic layers can be applied on Al 1100 alloys and Mg-RE alloys by using a 1:2 mixture of choline chloride and urea additivated with metal ions and, in the case of nickel, a suitable complexing agent (ethylenediamine).…”

Section: Industrial Applicability Of Metal Deposition From Dessmentioning

confidence: 78%

“…The resulting coatings present good adhesion and corrosion behaviour. Other metals, such as chromium, can be plated on the resulting nickel if it is used as adhesion layer, producing thus multilayers [68].…”

Section: Industrial Applicability Of Metal Deposition From Dessmentioning

confidence: 99%

Electrodeposition from Deep Eutectic Solvents

Bernasconi¹,

Panzeri²,

Accogli³

et al. 2017

Progress and Developments in Ionic Liquids

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Deep eutectic solvents constitute a class of compounds sharing many similarities with properly named ionic liquids. The accepted deinition of ionic liquid is a luid liquid for T< °C) consisting of ions, while DES are eutectic mixtures of Lewis or "rønsted acids and bases. Their most atractive properties are the wide potential windows and the chemical properties largely diferent from aqueous solutions. In the last few decades, the possibility to electrodeposit decorative and functional coatings employing deep eutectic solvents as electrolytes has been widely investigated. " large number of the deposition procedures described in literature, however, cannot ind application in the industrial practice due to competition with existing processes, cost or diicult scalability. From one side, there is the real potential to replace existing plating protocols and to ind niche applications for high added-value productions to the other one, this paves the path towards the electrodeposition of metals and alloys thermodynamically impossible to be obtained via usual aqueous solution processes. The main aim of this chapter is therefore the critical discussion of the applicability of deep eutectic solvents to the electrodeposition of metals and alloys, with a particular atention to the industrial and applicative point of view.Keywords: electrodeposition, deep eutectic solvents, metals, alloys . IntroductionThe electrodeposition of metals for industrial surface inishing is nowadays a well-established industrial practice. Many processes are available to obtain a wide variety of coatings on most of © 2017 The Author(s). Licensee InTech. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.© 2017 The Author(s). Licensee InTech. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. the substrates used in manufacturing. There are however some important limitations, as not all the metal/substrate combinations are possible in the current state of the art. This is connected to the nature of the electrolytes used for the vast majority of the plating processes, which are water based. Water is the most obvious choice to formulate a plating electrolyte, and in the majority of the cases, it is also the most convenient from the point of view of the results obtained. This solvent however presents some limitations: narrow potential window, reactivity towards speciic metals, high hydrogen evolution in speciic conditions, etc. If metal plating is limited to aqueous solutions, many possibilities are therefore precluded." possible way to extend the range of coating/substrate combinations is the use of non-aqueous solvents, characterized by ext...

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“…14,15 For these reasons, the number of publications on electrodeposition from DES is spectacularly increasing, notably for nickel. [16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34] The electrodeposition from these non-aqueous baths have proven successful to obtain nickel coatings, [18][19][20]34 nickel-based alloys 21,22,24,25,27,28,35 and nanostructured nickel films for corrosion resistance. 29,30 Similarly, DES were also used for the synthesis of a multitude of nanostructures (Pd, 36 Au, 37 ...), due to the capability of these solvents to slow down the electrochemical processes, thus, having a better control of the deposition of nanostructures.…”

Section: Introductionmentioning

confidence: 99%

On the Control and Effect of Water Content during the Electrodeposition of Ni Nanostructures from Deep Eutectic Solvents

et al. 2018

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The electrodeposition of nickel nanostructures on glassy carbon was investigated in 1:2 choline chloride urea (1:2 ChCl-U) deep eutectic solvent (DES) containing different amounts of water. By combining electrochemical techniques, with ex-situ FE-SEM, HAADF-STEM and EDX, the effect of water content on the electrochemical processes occurring during nickel deposition was better understood. At highly negative potentials and depending on water content, Ni growth is halted due to water splitting and the formation of a mixed layer of Ni/NiO x (OH) 2(1−x)(ads). Moreover, under certain conditions, the DES components can also be (electro)chemically reduced at the electrode surface, blocking further 3D growth of the Ni NPs. Hence, a 2D crystalline Ni containing network can be formed in the inter-particle region. in the inter-particle region. Careful tuning of the water content leads to a fine control of the deposition potentials of Ni and the side reactions occurring at more negative potentials, giving the ability to control self-limiting growth and passivation phenomena. Supporting Information Available Water content. The 3 rd scan of the CVs of Figures 1, 2 and 3. Influence of stirring. Selected area electron diffraction (SAED).

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Electrodeposition of nickel from DES on aluminium for corrosion protection

Cited by 29 publications

References 24 publications

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

Surface Sensitive Nickel Electrodeposition in Deep Eutectic Solvent

Electrodeposition from Deep Eutectic Solvents

On the Control and Effect of Water Content during the Electrodeposition of Ni Nanostructures from Deep Eutectic Solvents

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