Electrodeposition of Niobium from the CsBr-KBr-NbBr₃ Melt

Abstract

The CsBr-KBr-NbBr3 melt was proposed as a promising electrolyte for obtaining high-quality niobium coatings. This melt is less aggressive and provides a higher deposition rate of dense Nb layers compared to the fluoride and chloride electrolytes commonly used for electrodeposition of niobium. The effect of temperature and cathode current density during electrodeposition from the CsBr-KBr-NbBr3 melt on the structure and morphology of the Nb coatings was investigated. The conditions for the deposition of thick, dense, well-adherent Nb coatings were found. Cyclic voltammetry was used to study the regularities of the cathode process in the CsBr-KBr (57 mol% CsBr − 43 mol% KBr) - NbBr3 melts containing 0.4, 1.6, and 4.45 wt% Nb in a temperature range of 893 to 1013 K. A two-stage mechanism with the participation of Nb(III) and Nb(II) ions was proposed and the effective diffusion coefficient of niobium cations in the bromide melt was estimated based on a comparison of data obtained by cyclic voltammetry and numerical simulation.

Hybrid electrochemical additive and subtractive manufacturing (HEASM) based on simultaneous mask electrochemical deposition and dissolution

“…Micro-components are widely required in aerospace [1], precision mould [2], and integrated circuit [3,4] applications due to their excellent integration properties [5,6].…”

Electrodeposition of Niobium Coatings on the Cryogyroscope Rotor

“…Niobium coatings can be deposited in a variety of ways: thermal spraying (TS), 1,2 physical vapor deposition (PVD), 3,4 magnetron sputtering, [5][6][7] ion beam assisted deposition, 8 chemical vapor deposition (CVD), 9,10 and electrodeposition. [11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30] TS is a low cost and a high efficiency method, it is suitable for preparation of thick coatings, which do not require a high density and surface smoothness. The Nb coatings prepared by PVD are smooth and dense; however, a high cost and low deposition efficiency make this method only suitable for preparing nanoscale thin films.…”