Electrodeposition of Sn and NiSn alloys coatings using choline chloride based ionic liquids—Evaluation of corrosion behavior

Anicăi, Liana; Petica, Aurora; Costovici, Stefania; Prioteasa, Paula; Visan, Teodor

doi:10.1016/j.electacta.2013.08.043

Cited by 68 publications

(33 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…those that can be deposited individually and those that can be only codeposited. The former group consists of metals that are much nobler than Ni, like Ag [54][55][56][57] and Cu [58][59][60][61][62][63][64][65][66][67][68]; metals that have similar standard potentials, such as Co [69][70][71][72][73][74][75][76] and Sn [77][78][79][80][81][82][83][84][85]; and metals that are more cathodic, like Cr [86,87], Zn [88][89][90][91][92][93][94][95][96][97][98][99][100] and Mn [101]…”

Section: Deposition Of Ni Alloysmentioning

confidence: 99%

“…The use of Ni-Sn films as the barrier layer is reported to improve the wear resistance of electrical contacts. As a result, these alloys are especially interesting for electronic industries [82].…”

Section: Deposition Of Ni Alloysmentioning

confidence: 99%

“…They found that the oxalate-sulfate bath offers a higher throwing power, a finer crystalline structure, and a better corrosion behavior. Rudnik superior Ni-Sn films has also been investigated [82].…”

Section: Deposition Of Ni Alloysmentioning

confidence: 99%

See 2 more Smart Citations

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Bahramian¹,

Eyraud²,

Vacandio³

et al. 2019

Microelectronic Engineering

View full text Add to dashboard Cite

show abstract

Section: Deposition Of Ni Alloysmentioning

confidence: 99%

Section: Deposition Of Ni Alloysmentioning

confidence: 99%

See 1 more Smart Citation

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Bahramian¹,

Eyraud²,

Vacandio³

et al. 2019

Microelectronic Engineering

View full text Add to dashboard Cite

show abstract

“…As expected, the nature of DESs produced an influence on the properties of NiSn alloys, with better deposits obtained from ChCl/EG (1:2 molar ratio). Interestingly, the morphology of NiSn alloys depended on the operating parameters, but the composition was found to be quite constant, regardless of the value of the applied current density . Wang and coworkers found that unlike in aqueous solutions, the onset reduction potentials for Ni and for Cu in ChCl/urea (1:2 molar ratio) were close to each other, indicating that NiCu codeposition could easily be achieved from this liquid without the addition of a complexing agent.…”

Section: Direct Electrodeposition From Ilsmentioning

confidence: 99%

Electrodeposition in Ionic Liquids

et al. 2015

View full text Add to dashboard Cite

Due to their attractive physico-chemical properties, ionic liquids (ILs) are increasingly used as deposition electrolytes. This review summarizes recent advances in electrodeposition in ILs and focuses on its similarities and differences with that in aqueous solutions. The electrodeposition in ILs is divided into direct and template-assisted deposition. We detail the direct deposition of metals, alloys and semiconductors in five types of ILs, including halometallate ILs, air- and water-stable ILs, deep eutectic solvents (DESs), ILs with metal-containing cations, and protic ILs. Template-assisted deposition of nanostructures and macroporous structures in ILs is also presented. The effects of modulating factors such as deposition conditions (current density, current density mode, deposition time, temperature) and electrolyte components (cation, anion, metal salts, additives, water content) on the morphology, compositions, microstructures and properties of the prepared materials are highlighted.

show abstract

“…The results suggested the possibility of electroplating the Sn-Bi alloys with their composition around the eutectic point. The influence of the choline chloride eutectics composition on the properties of Sn and Sn-Ni alloys has been also evidenced in [32]. In the case of Zn-Sn alloys, their morphology and composition can be changed by judicious choice of the DES containing electrolyte composition [33].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Anicăi

Petica

Costovici³

et al. 2019

Coatings

View full text Add to dashboard Cite

Tin–indium alloys represent attractive lead-free solder candidates. They show lower values of melting point than pure indium, so that they are investigated as materials with significant applications potential in the electronic industry. Electrodeposition is a very convenient route to prepare Sn–In alloys. The paper presents several experimental results regarding the electrodeposition of Sn–In alloy coatings involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol eutectic mixtures. The influence of the main operating parameters on the Sn–In alloy composition and characteristics are presented. Adherent and uniform Sn–In alloy deposits containing 10–65 wt % In have been obtained on Cu substrates. The In content was found to increase as both the In:Sn molar concentration ratio of ionic species in the electrolyte and the applied temperature increased. The use of pulsed current allowed the use of higher current densities leading to slightly higher values of In content in the alloy deposit. X-ray diffraction (XRD) analysis revealed the presence of InSn4 and In3Sn phases in agreement with the phase diagram. According to thermogravimetric analysis (TGA) measurements, values of melting points in the range of 118.6 and 127.5 °C were obtained depending on the alloy composition. The solder joints’ behavior and alloy coatings corrosion performance were also discussed.

show abstract

Electrodeposition of Sn and NiSn alloys coatings using choline chloride based ionic liquids—Evaluation of corrosion behavior

Cited by 68 publications

References 21 publications

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

Electrodeposition in Ionic Liquids

Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Contact Info

Product

Resources

About