Electrodeposition of Titanium Diboride Coatings

A porous titanium diboride composite cathode coating for Hall-Héroult cells: Part I. Thin coatings

“…However, the absorption is considerably less than what the pitch in the carbon cathode can absorb. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] Therefore, an immediate benefit in sodium loss is generally noted [27] during the early stages of cell operation. The formation of the sodium aluminate and the ␤-alumina have been verified from the X-ray analysis of the samples after the sodium resistance tests.…”

“…These coating techniques include electrodeposition, plasma spraying, glazing with a powder layer, or chemical vapor deposition. [6][7][8][9][10][11][12][13][14][15] Most coating techniques, however, are generally not suitable for utilization on an industrial scale. During the early stages of electrolysis, sodium is deposited on the cathode.…”

Stable attachment of TiB/sub 2/-based cathodes for the aluminium industry: Review and recommendation

“…(a) The adherence varies with the thermal expansion of the substrate material. High expansion graphite and several refractory metals including titanium have CTEs that are compatible with Ti82; however, these metals are chemically reactive with flouride-based electroplating baths, and a protective base coat of copper or nickel is required {Schlain, McCawley and Smith 1976;Townsend and Boxall 1984). In a study by Townsend and Boxall (1984), it was claimed that electroplated TiB 2 coatings to be used for Soderberg anode stud fastener applications are resistant to attack by cryolite and aluminum.…”

“…Several authors have reported plasma-spraying TiB 2 coatings. (b) AlthOLgh this method is certainly attractive because of the rapid deposition rates (a) Townsend and Boxall 1984;Schlain, McCawley, and Smith 1976;Flinn et al 1979;Flinn et al 1981;McCawley, Schlain, and Wyche 1974;Schlain, McCawley, and Wyche 1969;Gomes, Uchida, and Wong 1975;Kellner 1975;Bracuti and Bottei 1984;Kirk, lynch, and VanStratum 1981. (b) Dallaire and Champagne 1984;Townsend and Boxall 1984;Fletcher 1979;Schreyer et al 1979;Kugler and Rieger 1974;Morozumi, Kikuchi, and Kanazawa et al 1981.…”

The Unexpected Formation of MB2 Layers (M = Refractory Metal) on Metal Surfaces

“…Somewhat thicker layers can be formed by sputtering (500 nm) [18] and electrodeposition. [19][20][21][22][23] We report here on a simple chemical process to coat refractory metals with layers of metal diborides by using chemical reactions at the solid/gas interface. The layer thickness is in the magnitude of up to some hundred μm.…”