“…As a result, brighteners can also help level the micro profile of the electrode surface without the need for polishing after the deposition. , Additives, such as bis(3-sulfopropyl) disulfide (SPS) that acts a brightner, − and sodium gluconate, , are typically used in copper and nickel plating baths, respectively, and an extensive library of additives have been investigated for other metal depositions. ,, Surfactants, such as cetyltrimethylammonium bromide (CTAB), have also been used in deposition baths due to their potential to affect the surface tension between the electrolyte and the electrode and can have effects on coating adhesiveness and morphology at varying concentrations. , Depending on the interactions of CTAB with the substrate or the active metal being deposited, it may act as a leveling or brightening agent. − Additonally, CTAB can interact directly with the deposited metal instead of the substrate and has been used to cap the growth of particles as demonstrated in nanoparticle synthesis − and also has the potential to act as a corrosion inhibitor . Despite the tunability that can be acheived through these organic additives, there are few publications reporting the tunability of electrodeposited Sb anodes for battery applications using solution additives. , …”