Electrodeposition of well adherent metallic clusters on carbon substrates

Riccardis, M.F. De; Carbone, D.

doi:10.1016/j.apsusc.2005.12.055

Cited by 14 publications

(14 citation statements)

References 5 publications

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“…Nevertheless, nano-scratch tests were performed on Ni coated supports by means of Atomic Force Microscope (AFM) equipped with a diamond tip; the metallic clusters were moulted and not removed by the diamond tip. The experimental details are reported in [2].…”

Section: Introductionmentioning

confidence: 99%

“…For this reason, we are interested in characterising the nature of the bond between Ni clusters and substrate [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

“…Electrodeposition of metallic clusters has a host of cutting edge prospective applications, such as the catalytic growth of carbon nanotubes (CNT) in CVD processes [1][2][3]. In order to obtain a reliable catalytic surface for CNT, and in general for the growth of carbon nanostructures (CNS), such as nanofibres or nanowalls, a key property is the adherence of the clusters to the substrate.…”

Section: Introductionmentioning

confidence: 99%

“…Well adhered metallic coatings can be produced by electrodeposition once the plating parameters, the substrate treatments and the electrolytic bath composition are optimized [4][5][6]. In previous papers the authors demonstrated that it is possible to obtain well adhered and uniformly distributed Ni clusters, on PAN-based fibres and carbon paper [1,2]. The good adhesion of electrodeposited Ni clusters was demonstrated by performing several experiments, consisting in immersion, magnetic stirring, centrifugation and ultrasonication into different liquids (such as deionized water, ethanol, acetone, n-butanol).…”

Section: Introductionmentioning

confidence: 99%

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Study on the adhesion mechanism of electrodeposited nickel clusters on carbon substrates

Riccardis

Carbone

Martina

et al. 2009

Applied Surface Science

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Section: Introductionmentioning

confidence: 99%

“…For this reason, we are interested in characterising the nature of the bond between Ni clusters and substrate [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Study on the adhesion mechanism of electrodeposited nickel clusters on carbon substrates

Riccardis

Carbone

Martina

et al. 2009

Applied Surface Science

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“…z E-mail: scyen@ntu.edu.tw that imparts excellent thermal and electrical conductivity to graphite and reduces the silver content of conductive fillers. Many methods have been adopted for surface metallization of materials, including electrophoretic deposition, 17 electrodeposition, 18 and chemical vapor deposition. 19 However, these techniques require either special equipment or complicated process control.…”

mentioning

confidence: 99%

Electrically Conductive Adhesives with Low Ag Content Prepared by Ag Self-Activated Plating and PEDOT:PSS

Chueh¹,

Hu²,

Yen³

2014

J. Electrochem. Soc.

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Silver-plated graphite powder, poly (3,4-ethylenedioxythiolphene):poly(styrenesulfonate) (PEDOT:PSS), and organic additives were employed to reduce the electrical resistivities of epoxy-based adhesives. A novel silver self-activated electroless deposition using conductive graphite particles as filler in electrically conductive adhesives (ECAs) was investigated to develop high-performance ECAs with low silver content. Adding silver-plated graphite powders to the conductive adhesives reduced their electrical resistivities by at least two orders of magnitude compared with those filled with graphite powders only. The silver content of the adhesive with PEDOT:PSS decreased to 24.7 wt%, and its resistivity was 1.2 × 10 −3 cm. The best electrical resistivity of the epoxy-based conductive adhesives with 70 wt% silver-plated graphite powders was 4.36 × 10 −4 cm. The weight percentage of silver in this epoxy-based adhesive decreased to 43.3 wt%, which is much lower than that of conventional silver conductive adhesives. Polymer-based conductive adhesives have been utilized widely in many applications, for example, electronic interconnects, lightemitting diode and photovoltaic technologies.1 Electrically conductive adhesives (ECAs) have acquired prominence as potential substitutes for solder interconnects. They not only provide a lead-free replacement for solder, but these highly conductive materials also offer feasible alternatives to problems arising from insufficient solder. ECAs are chiefly composed of organic/polymeric binder matrices and conductive fillers. Intrinsically conductive polymers can conduct electric current without requiring addition of conductive media, and extrinsically conductive polymers require the addition of conductive media in order to be more electrically conductive. Extrinsically conductive polymers are divided into isotropic conductive adhesives and anisotropic conductive adhesives according to filler concentration. 2The electrical resistivities of extrinsically conductive polymers are influenced by the amount of conductive fillers, degree of resin curing and cross-link density, diameter and shape of conductive fillers, degree of dispersion, and so forth.3-8 Poly(p-phenylene), polyaniline, polypyrrole, polythiophene, and polyacetylene are conjugated conductive polymers. Their electrical conductivities can be increased dramatically by dopants. [9][10][11][12][13][14][15] The conducting polymer polypoly(3,4-ethylenedioxythiolphene):poly(styrenesulfonate) (PEDOT:PSS) is usually synthesized using an electrochemical method or by chemical synthesis. Particularly promising results have been obtained with electrochemically synthesized poly(3,4-ethylenedioxythiophene) (PE-DOT) doped with PF 6 or with other small-molecule dopants; the room-temperature conductivity of PEDOT-PF 6 films could reach 200-300 S cm −1 . 16Conductive fillers confer excellent electrical properties to ECAs, and polymeric matrixes impart their physical and mechanical properties. Therefore, selection of suitable materials and prepara...

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TEM investigations on Ni clusters electrodeposited on Carbon substrate

Riccardis

Carbone

et al. 2008

EMC 2008 14th European Microscopy Congress 1–5 September 2008, Aachen, Germany

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Electrodeposition of well adherent metallic clusters on carbon substrates

Cited by 14 publications

References 5 publications

Study on the adhesion mechanism of electrodeposited nickel clusters on carbon substrates

Study on the adhesion mechanism of electrodeposited nickel clusters on carbon substrates

Electrically Conductive Adhesives with Low Ag Content Prepared by Ag Self-Activated Plating and PEDOT:PSS

TEM investigations on Ni clusters electrodeposited on Carbon substrate

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