Electrodynamic analysis of combined microstrip and coplanar/slotine structures with 3-D components based on a surface/volume integral-equation approach

Vaupel, Thomas; Hansen, V.

doi:10.1109/22.788514

Cited by 37 publications

(21 citation statements)

References 14 publications

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“…The finite size of the plastic package can already be taken into account in FDTD and FEM solvers. A method to take into account small finite dielectric volumes in a planar stratified background medium consists of combining an S/BIE with a volume integral equation (VIE) [18]. Such developments are already offered by Sonnet em, and are under development by Zeland Software and at K.U.…”

Section: Device Under Computationmentioning

confidence: 99%

Benchmark of full Maxwell 3D electromagnetic field solvers on an SOIC8 packaged and interconnected circuit

Vrancken

Aerts

Vandenbosch

2006

Int J RF and Microwave Comp Aid Eng

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The MAGMAS3D full Maxwell electromagnetic field solver developed at Katholieke Universiteit. Leuven is benchmarked with several commercially available solvers in the analysis of a complete industry-standard SOIC8 (single-outline integrated circuit with eight leads) circuit, packaging, and interconnection topology. The benchmark deals with predicted results as well as computer speed and memory. The benchmark description and results should give practicing engineers valuable insights into (at least part of) the products on the presentday full-wave 3D EM simulation market.

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Section: Device Under Computationmentioning

confidence: 99%

Benchmark of full Maxwell 3D electromagnetic field solvers on an SOIC8 packaged and interconnected circuit

Vrancken

Aerts

Vandenbosch

2006

Int J RF and Microwave Comp Aid Eng

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“…The new techniques start with a combined space/spectral domain formulation as presented in References [5,10,4]. This approach can handle Planar-3D (M)MIC configurations with both microstrip and slot structures as well as airbridges, vertical interconnects and finite dielectric regions embedded in an arbitrary multilayered medium.…”

Section: Formulationmentioning

confidence: 99%

“…With regard to the standard MoM, many improvements could be achieved for a faster and more accurate computation of the system matrix. Various techniques have been developed related to space domain evaluation [1][2][3] as well as to spectral domain evaluation of the matrix entries [4][5][6]. Thus, matrix fill time could be drastically reduced without compromising the accuracy of the computations.…”

Section: Introductionmentioning

confidence: 99%

Spectral domain analysis of large (M)MIC‐structures using novel quadrature methods

Vaupel¹,

Eibert²,

Hansen³

2004

Int J Numerical Modelling

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SUMMARYThe spectral domain approach for the solution of integral equations is especially attractive for planar circuits and antennas in multilayered environments characterized by analytically derived Green's functions. However, for circuits with large lateral dimensions the spectral integrands are strongly oscillatory and accurate evaluation of the integrals is extremely difficult and often time-consuming. In this paper, we propose higher-order Legendre quadrature rules optimized for the integration of the oscillating integrands using the Filon principle. The Legendre-Filon quadrature weights are computed for the specific oscillations by solving a small linear system of equations. The method is applied within a spectral domain solution approach evaluating the spectral integrals in cartesian wavenumbers and using asymptotic extraction techniques as well as complex integration path deformation for improved convergence. Since the asymptotic extraction causes a singularity in the origin of the wavenumber domain that is not annihilated by cartesian wavenumber integration, a special procedure for the treatment of this singularity is also introduced. The overall method needs very few sampling points for the numerical evaluation of the spectral integrals but is still applicable to very large structures as compared to the wavelength.

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“…With our approach, the analysis is performed with a complete spectral domain formulation for pure planar structure parts with high efficiency. For the additional analysis of quasi 3D-elements, space domain integrations of the pertinent Green's functions are carried out analytically with regard to the vertical direction leading to extended spectral domain Green's functions demonstrated in [5]. After sampling the Cartesian wavenumber plane, all Green's functions are computed and stored at the selected sampling points.…”

Section: Introductionmentioning

confidence: 99%

A fast space-spectral domain solver for quasi-3D structures with arbitrary vertical conductors in multilayered media

Vaupel

2010

2010 URSI International Symposium on Electromagnetic Theory

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This contribution deals with a surface/volume integral equation formulation for the characterization of quasi-3D structures in multilayered media where the vertical conductors can cross an arbitrary number of layers. The vertical volume currents used for the modeling of the vertical conductors of the quasi-3D components are incorporated by extended spectral domain Green's functions derived by analytical integrations over the vertical direction and by a summation over the Cartesian wavenumbers which must be computed only once and stored in a database. With this database and a combination approach for the matrix filling process, also complex quasi-3D structures can be analyzed with the same performance than pure planar structures. The approach is also well-suited for the set up of a fast solver with similar properties than fast multipole approaches in free space

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Electrodynamic analysis of combined microstrip and coplanar/slotine structures with 3-D components based on a surface/volume integral-equation approach

Cited by 37 publications

References 14 publications

Benchmark of full Maxwell 3D electromagnetic field solvers on an SOIC8 packaged and interconnected circuit

Benchmark of full Maxwell 3D electromagnetic field solvers on an SOIC8 packaged and interconnected circuit

Spectral domain analysis of large (M)MIC‐structures using novel quadrature methods

A fast space-spectral domain solver for quasi-3D structures with arbitrary vertical conductors in multilayered media

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