2022
DOI: 10.1021/acsaelm.2c00472
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Electroforming-Free Y2O3Memristive Crossbar Array with Low Variability

Abstract: Transition metal oxides play a very important role to develop the memristive crossbar array for nonvolatile memory for storage and logic operations. However, the development of a high-density memristive crossbar array for complex applications is restricted due to low device yield and high device-to-device (D2D) and cycle-to-cycle (C2C) variability in device switching voltages. Here, we report the fabrication of a stable, highly scalable, reproducible, Y2O3-based memristive crossbar array of (15 × 12) on silico… Show more

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Cited by 17 publications
(11 citation statements)
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“…Memristors typically exhibit undesirable variations in resistance values and SET and RESET voltages from one device to device (also called D2D or spatial variation) and from one cycle to cycle (also called C2C or temporal variation). 165,166 From the perspective of physical mechanism, the cycle-to-cycle variation originates from the stochastic formation and rupture of conductive filaments. 43 The device-to-device variation stems from the limitations of fabrication techniques, which produce nonideal film morphology and homogeneity, resulting in the different electrical characteristics between memristors.…”
Section: Variationmentioning
confidence: 99%
“…Memristors typically exhibit undesirable variations in resistance values and SET and RESET voltages from one device to device (also called D2D or spatial variation) and from one cycle to cycle (also called C2C or temporal variation). 165,166 From the perspective of physical mechanism, the cycle-to-cycle variation originates from the stochastic formation and rupture of conductive filaments. 43 The device-to-device variation stems from the limitations of fabrication techniques, which produce nonideal film morphology and homogeneity, resulting in the different electrical characteristics between memristors.…”
Section: Variationmentioning
confidence: 99%
“…Figure 1b depicts the field emission scanning electron microscopy (FESEM), which reveals a continuous SL of Y 2 O 3 with compact grains, as reported previously. 10 Furthermore, Figure 1c depicts the cross-sectional view of the high-resolution transmission electron microscopy (HR-TEM), wherein all the deposited layers are distinct to each other having clear interfaces in the fabricated structure. The HRTEM analysis also confirms the absence of interfacial oxide between the Si and Y 2 O 3 insulating layer, which is beneficial for uniform SL deposition 10 to form an abrupt interface.…”
Section: Characterizationsmentioning
confidence: 99%
“…10 Furthermore, Figure 1c depicts the cross-sectional view of the high-resolution transmission electron microscopy (HR-TEM), wherein all the deposited layers are distinct to each other having clear interfaces in the fabricated structure. The HRTEM analysis also confirms the absence of interfacial oxide between the Si and Y 2 O 3 insulating layer, which is beneficial for uniform SL deposition 10 to form an abrupt interface. Figure 1d shows the atomic force microscopy (AFM) analysis, in which the surface root mean roughness of the SL is below 2 nm.…”
Section: Characterizationsmentioning
confidence: 99%
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