Electrofragmentation modeling of conductive coatings on polymer substrates

Leterrier, Y.; Pinyol, A.; Rougier, Luc; Waller, Judith H.

doi:10.1063/1.3266001

Cited by 20 publications

(24 citation statements)

References 28 publications

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“…(2)). A model to correlate the tensile damage with the resistance increase within fragmentation stages I and II was moreover proposed in a recent work [56], enabling automatic detection of the overall damage development in ultrathin coatings on polymers. The electro-fragmentation method thus provides a powerful alternative to the rather impracticable optical detection of cracks in the case of experiments that may last few seconds (high strain rate), or several days or weeks (low strain rate and fatigue).…”

Section: The Fragmentation and Electro-fragmentation Test Methodsmentioning

confidence: 99%

Mechanical integrity of thin inorganic coatings on polymer substrates under quasi-static, thermal and fatigue loadings

et al. 2010

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The interplay between residual stress state, cohesive and adhesive properties of coatings on substrates is reviewed in this article. Attention is paid to thin inorganic coatings on polymers, characterized by a very high hygro-thermo-mechanical contrast between the brittle and stiff coating and the compliant and soft substrate. An approach to determine the intrinsic, thermal and hygroscopic contributions to the coating residual stress is detailed. The critical strain for coating failure, coating toughness and coating/substrate interface shear strength are derived from the analysis of progressive coating cracking under strain. Electrofragmentation and electro-fatigue tests in situ in a microscope are described. These methods enable reproducing the thermo-mechanical loads present during processing and service life, hence identifying and modeling the critical conditions for failure. Several case studies relevant to food and pharmaceutical packaging, flexible electronics and thin film photovoltaic devices are discussed to illustrate the benefits and limits of the present methods and models.

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Section: The Fragmentation and Electro-fragmentation Test Methodsmentioning

confidence: 99%

Mechanical integrity of thin inorganic coatings on polymer substrates under quasi-static, thermal and fatigue loadings

et al. 2010

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“…The influence of various electrical probes on the internal strain in the multilayers and the accuracy of the crack onset strain observation have also been investigated. 17 The mechanical two-point bending method was first developed to study the strength of optical fibers and the fracture of the fiber was sensed by an acoustic detector. [18][19][20] Recently this method was modified to characterize the fracture of thin conductive layers, such as ITO, on a polymer substrate by measuring its electrical resistance.…”

Section: Introductionmentioning

confidence: 99%

Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Guan

Lavèn

Bouten

et al. 2013

Journal of Applied Physics

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Mechanical failure resulting from subcritical crack growth in the SiNx inorganic barrier layer applied on a flexible multilayer structure was studied by an electro-mechanical two-point bending method. A 10 nm conducting tin-doped indium oxide layer was sputtered as an electrical probe to monitor the subcritical crack growth in the 150 nm dielectric SiNx layer carried by a polyethylene naphthalate substrate. In the electro-mechanical two-point bending test, dynamic and static loads were applied to investigate the crack propagation in the barrier layer. As consequence of using two loading modes, the characteristic failure strain and failure time could be determined. The failure probability distribution of strain and lifetime under each loading condition was described by Weibull statistics. In this study, results from the tests in dynamic and static loading modes were linked by a power law description to determine the critical failure over a range of conditions. The fatigue parameter n from the power law reduces greatly from 70 to 31 upon correcting for internal strain. The testing method and analysis tool as described in the paper can be used to understand the limit of thin-film barriers in terms of their mechanical properties.

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“…The electrical method (a.k.a. "electrofragmentation" 10,11 ) measures a resistance R and recently 9 a simple model was proposed which relates this quantity to the crack length and speed in a homogeneously strained sample.…”

Section: Introductionmentioning

confidence: 99%

Effect of relative humidity on crack propagation in barrier films for flexible electronics

Vellinga

Hosson

Bouten

2012

Journal of Applied Physics

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The effects of buffer layers on the performance and stability of flexible InGaZnO thin film transistors on polyimide substrates Appl. Phys. Lett. 104, 063508 (2014); 10.1063/1.4864617 Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics Appl. Phys. Lett. 103, 241904 (2013); 10.1063/1.4845995Strain on field effect transistors with single-walled-carbon nanotube network on flexible substrate A set of propagating cracks in a SiN barrier film on poly ethylene naphthalate (PEN) were subjected to differing levels of relative humidity. It was observed that the propagation speed of the cracks increased for increasing levels of relative humidity. This was shown using two independent, simultaneous techniques. One of the techniques (a resistance measurement) gives a qualitative measure of the averaged crack tip speed and the other (a microscopic technique) a quantitative measure. An attempt is made to quantify the resistance measurements in terms of crack tip speed. The effects that humidity may have on the crack driving force through differences in hygroscopic expansion are discussed, using independent determination of the diffusion constant of water into PEN. It is concluded that hygroscopic expansion alone cannot account for the observations. V C 2012 American Institute of Physics. [http://dx.

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Electrofragmentation modeling of conductive coatings on polymer substrates

Cited by 20 publications

References 28 publications

Mechanical integrity of thin inorganic coatings on polymer substrates under quasi-static, thermal and fatigue loadings

Mechanical integrity of thin inorganic coatings on polymer substrates under quasi-static, thermal and fatigue loadings

Subcritical crack growth in SiNx thin-film barriers studied by electro-mechanical two-point bending

Effect of relative humidity on crack propagation in barrier films for flexible electronics

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