Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Abstract

Cu-P-silicon carbide (SiC) composite coatings were deposited by means of electroless plating. The effects of pH values, temperature, and different concentrations of sodium hypophosphite (NaH 2 PO 2 ·H 2 O), nickel sulfate (NiSO 4 ·6H 2 O), sodium citrate (C 6 H 5 Na 3 O 7 ·2H 2 O) and SiC on the deposition rate and coating compositions were evaluated, and the bath formulation for Cu-P-SiC composite coatings was optimised. The coating compositions were determined using energy-dispersive X-ray analysis (EDX). The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows: pH 9; temperature, 90ºC; NaH 2 PO 2 ·H 2 O concentration, 125 g/L; NiSO 4 ·6H 2 O concentration, 3.125 g/L; SiC concentration, 5 g/L; and C 6 H 5 Na 3 O 7 ·2H 2 O concentration, 50 g/L. The surface morphology of the coatings analysed by scanning electron microscopy (SEM) shows that Cu particles are uniformly distributed. The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

Electrochemical detection of DNA by using “Pd/GO label copper stain” for signal amplification

“…S2 †), the typical absorption signal (at 260 nm) from DNA is observed compared with that of pure Pd/GO NPs, demonstrating that ssDNA label was successfully linked to the surface of Pd/GO NPs. 14 Additionally, it is noteworthy that for the commercial electroless copper plating solutions NaH 2 PO 2 is generally used as a reducing agent, 15 in which small amounts of phosphorus could also be co-deposited in the deposit to form a Cu-P alloy. This will affect the subsequent oxidative dissolution of copper during the DPV measurements.…”

The development supercapacitor from activated carbon by electroless plating—A review

“…On the other hand, electroless deposition (ED) is an effective route to deposit metal nanoparticles [4,16,22] and polymers [31]. There are many advantages with the ED technique: low cost; high reproducibility, a simple process and the requirement of very simple equipment [41][42][43][44][45][46][47]. This review presents the investigation of supercapacitive performance of chemically deposited metal oxide thin film electrode materials by electroless deposition (ED) technique.…”

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

“…The improvement of the electrical conductivity of Cu films using ultrasonic‐assisted electroless deposition technique . These will be enhancement the corrosion resistance, hardness and wear resistance of the Cu―P coating by adding SiC particles to coating and the microstructure modification of Cu―Zn coating from highly porous of small acicular grains to denser structures of large nodular particles when the potassium sodium tartrate concentration increased in the coating bath . Additionally, a number of researchers have described the interaction between two phases, solid (coated films) and liquid (water, oil, ….…”