Electroless copper plating on a glass substrate coated with ZnO film under UV illumination

Yang, Ying; Wei, Yibin; Loo, B. H.; Yao, Jianhua

doi:10.1016/s0022-0728(98)00405-7

Cited by 28 publications

(14 citation statements)

References 16 publications

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“…It can be seen that the thermal annealing has no significant effect on the optical transmission from 350 to 500 • C. However, the optical transmittance has obviously decreased after annealing at 550-600 • C. These films appear metallic black color, which can be caused by some ZnO decomposed during annealing process, forming elemental zinc. Yang et al [24] observed the similar decomposition phenomenon in evaporated ZnO film from ZnO powder.…”

Section: Electrical Characteristicsmentioning

confidence: 68%

Low temperature growth of highly crystallized ZnO:Al films by ultrasonic spray pyrolysis from acetylacetone salt

Wang

Yang

et al. 2010

Materials Science and Engineering: B

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Section: Electrical Characteristicsmentioning

confidence: 68%

Low temperature growth of highly crystallized ZnO:Al films by ultrasonic spray pyrolysis from acetylacetone salt

Wang

Yang

et al. 2010

Materials Science and Engineering: B

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“…[4][5][6][7][8]13,14,16,17,19,27,30,31 The silane solution was made in ethanol to facilitate penetration into small diameter holes. The silane treated surface was baked to hydrolyze the silane to improve its adhesion to the glass and to remove excess volatile material.…”

Section: Resultsmentioning

confidence: 99%

“…Additive methods that affect both the surface topography and surface chemistry include the growth of nano sized silica particles 4 D3229 (<10 nm) on glass surfaces to provide a very fine topography which improved adhesion of electroless Cu layers up to 500 nm thickness so that they were able to pass a tape test, 4 and spray pyrolysis coating with Zinc oxide to enhance electroless Cu adhesion. 4,6,13 The former approach would be applicable to holes.…”

mentioning

confidence: 99%

Hybrid Method for Metallization of Glass Interposers

Ogutu

Fey

Børgesen

et al. 2013

J. Electrochem. Soc.

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Glass has gained interest as a material for interposer technology due to its low/adjustable thermal expansion coefficient, low cost, good dimensional stability and availability in large panels compared to silicon substrates. However, the metallization of glass constitutes a major challenge owing to the notoriously poor adhesion between glass and metals. In this work, strategies for improving the adhesion to the glass surface and for providing at the same time continuous coating of through glass holes (TGHs) are explored. As result, a hybrid approach for glass metallization based on sputtering of a thin Ti-Cu layer and subsequent coating by electroless Ni deposition is introduced and developed. The proposed approach takes advantage of the good adhesion of very thin sputtered films on glass surfaces and combines this with the ability of electroless plating to bridge center regions of high aspect TGHs that are inaccessible to metallization by sputtering. Robust layers deposited by the hybrid method, shown to continuously coat the surface and TGHs, allow for further Cu elctrodeposition on the way to final circuitry. Approaches explored for seeding, coating and further metallization are described in detail. Results of cross-section analysis, optical microscopy, and SEM are also presented.

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“…However, palladium is costly and has waste disposal problems [190,191]. Therefore, Yang et al [57] presented a ZnO thin film and ultraviolet (UV) illumination-based electroless deposition process to initiate the electroless deposition process without using PdCl 2 solution for glass surface activation. A ZnO thin film was developed on the glass by evaporating precursor ZnO powder in a vacuum chamber.…”

Section: Adhesion Improvement Using Chemical Processesmentioning

confidence: 99%

“…Electroless deposition, on the contrary, is an all-wet process that metallizes insulating substrates using chemical reactions [42][43][44][45][46][47][48]. It can create thin metallic layers on various metals and non-metals [49][50][51][52][53][54][55][56][57][58][59][60]. In PCB manufacturing, electroless copper deposition is extensively used to deposit thin copper layers on panels as large as 100 cm [61,62].…”

Section: Introductionmentioning

confidence: 99%

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

Surface Engineering

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This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.

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Electroless copper plating on a glass substrate coated with ZnO film under UV illumination

Cited by 28 publications

References 16 publications

Low temperature growth of highly crystallized ZnO:Al films by ultrasonic spray pyrolysis from acetylacetone salt

Low temperature growth of highly crystallized ZnO:Al films by ultrasonic spray pyrolysis from acetylacetone salt

Hybrid Method for Metallization of Glass Interposers

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

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