2014
DOI: 10.1016/j.surfcoat.2014.04.005
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Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation process

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Cited by 32 publications
(17 citation statements)
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“… This NaOH alcoholic solution is placed into in a 35-40 0 C water bath for 30 min.  The samples are placed in an aqueous solution with a certain ratio of nitric acid, hydrogen peroxide and NH 4 F.  It is exposed with a supersonic wave for 30min [6].…”
Section: Methodsmentioning
confidence: 99%
“… This NaOH alcoholic solution is placed into in a 35-40 0 C water bath for 30 min.  The samples are placed in an aqueous solution with a certain ratio of nitric acid, hydrogen peroxide and NH 4 F.  It is exposed with a supersonic wave for 30min [6].…”
Section: Methodsmentioning
confidence: 99%
“…Enhanced mechanical bonding increases adhesion between the EL coating and the substrate. Microstructural growth and bonding mechanism starts with the formation of globules in nano-size range on certain preferred location (nucleation stage) and then develop laterally to cover the whole surface along thickness direction with high uniformity (growth stage) [121]. The microstructure developed by electroless deposition is columnar as shown in Figure 10 [112].…”
Section: Electroless Platingmentioning
confidence: 99%
“…It was conducted with an ultrasonic wave (40 kHz, 100 W) for 30 min at 25 °C as a non-noble metal activation pretreatment, using an EAGLE Ultrasonic bath-EU8. The resultant specimen was then washed with deionized water for plating [12]. For the ionic liquid solution, chloride and ionic liquid were weighed with the molar ratio 2:1 and the specimen was immersed in the ionic solution and left for 24 hours [13].…”
Section: Etchingmentioning
confidence: 99%