Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

Abstract

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

Advances and challenges in scalable carbon dioxide electrolysis

“…For the reduction of resistance, gold plating on the electrolyzer surface can be attempted. 48 For the problem of carbonate precipitation blocking the active site, this is a difficulty common to MEA-type electrolytic cells at present. We will summarize a detailed solution in the subsequent part of the perspective.…”

The high fluorescence sensitivity property and quenching mechanism of one-dimensional Cd-HCIA-1 sensor for nitrobenzene

“…5(b). The bright green isosurface between the NB molecule and 5-HCIA 2À ligand reveals the van der Waals force 49,50 and indicates the presence of p-p interactions between NB and Cd-HCIA-1. The binding energy of the NB@Cd-HCIA-1 complex was 2.99 eV, which indicated that the formation of the complex was thermodynamically feasible.…”