“…Furthermore, based on the scientific reports, the addition of some inert particles such as Al 2 O 3 [8,9], SiC [10,11], TiO 2 [12], ZrO 2 [13,14], B 4 C [15] and diamond nanoparticles [16] to the plating bath in electroless and in electroplating methods lead to the co-deposition of the solid particles along with pure metals. It seems that the incorporation of these particles in a metal matrix increases the strength of thin films of metal like Ni, Cu, Zn and Ni-P alloy.…”