Electroless Deposition of Nickel

Schlesinger, M.

doi:10.1002/9780470602638.ch18

Cited by 51 publications

(106 citation statements)

References 22 publications

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“…These grain boundaries can be eliminated by using high P content nickel [24]. Schlesinger [22] also mentioned that the higher sizes of the nickel crystallites making up when the phosphorus content is lower. Thus, phosphorus can act as an inhibitor of crystal formation.…”

Section: ) Hydrazinementioning

confidence: 99%

“…Using reducing agent such as hydrazine can produce pure electroless nickel deposition, which is contain up to 90% of nickel [7], with oxygen and 10% of nitrogen [22]. [29].…”

Section: ) Hydrazinementioning

confidence: 99%

“…For example, binary alloys have Ni-P [19] and Ni-B [20], while ternary alloys have Ni-P-B [20], and Ni-W-P [21]. For quaternary alloys have Ni-W-Cu-P [9,22]. Tables 3 represent the types of electroless metallic alloy coatings and their features. In additional, electronic micro-component and packaging need a convenient barrier layer between Cu, Ag, Al, Ni, Au, Pd and Co [7], as well as solder to perpetuate a long period of services.…”

Section: A Introductionmentioning

confidence: 99%

“…There are five types of EN coatings such as pure nickel, black nickel, electroless composite electroless nano-coatings and electroless nickel alloy coatings [7]. EN alloy coatings may consist four types, as follow [22]:…”

Section: A Introductionmentioning

confidence: 99%

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Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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Abstract-The selection of surface finish on printed circuit board is very important in soldering process because it can prevent the copper from oxidation and provide solderable surface. It is also will influence the cost, manufacturing, shelf life, surface quality, final product reliability and environment.Electroless and immersion plating process has now become an important and popular surface finish in electronic industry due to simple and low cost process. The application of electroless plating are widely used in electronic industry, however it also was used in various industries such as aerospace, automotive, oil and gas, chemical processing where the need on the complex shape, homogeneous and uniform layer are required. Besides, every surface finish has their strength and weakness. Immersion silver is one of the surface finishes frequently used on the printed circuit board due to their characteristics such as good solderability and wettability, easy assembly and low cost. Both of these two processes were acts as barrier layer between copper substrate and solder balls. This review was discussed about electroless nickel and immersion silver plated on copper substrate, coating process and parameters involved. The topic also covered include the morphology and thickness of the intermetallics formed during soldering as well as the isothermal aging process.

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Section: ) Hydrazinementioning

confidence: 99%

“…Using reducing agent such as hydrazine can produce pure electroless nickel deposition, which is contain up to 90% of nickel [7], with oxygen and 10% of nitrogen [22]. [29].…”

Section: ) Hydrazinementioning

confidence: 99%

Section: A Introductionmentioning

confidence: 99%

Section: A Introductionmentioning

confidence: 99%

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Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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“…In fact, while we used a sputter coater, other thin film deposition techniques, including electroless deposition, and materials are readily amenable to this process. 21 Therefore, this is a versatile technology that enables configurable low cost and effective sorting of biological targets.…”

mentioning

confidence: 99%

Shrink-induced sorting using integrated nanoscale magnetic traps

Nawarathna

Norouzi

McLane

et al. 2013

Applied Physics Letters

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We present a plastic microfluidic device with integrated nanoscale magnetic traps (NSMTs) that separates magnetic from non-magnetic beads with high purity and throughput, and unprecedented enrichments. Numerical simulations indicate significantly higher localized magnetic field gradients than previously reported. We demonstrated >20 000-fold enrichment for 0.001% magnetic bead mixtures. Since we achieve high purity at all flow-rates tested, this is a robust, rapid, portable, and simple solution to sort target species from small volumes amenable for pointof-care applications. We used the NSMT in a 96 well format to extract DNA from small sample volumes for quantitative polymerase chain reaction (qPCR). V C 2013 American Institute of Physics.

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Virus‐Templated Nickel Phosphide Nanofoams as Additive‐Free, Thin‐Film Li‐Ion Microbattery Anodes

Records

Wei

Belcher

2019

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Transition metal phosphides are a new class of materials generating interest as alternative negative electrodes in lithium‐ion batteries. However, metal phosphide syntheses remain underdeveloped in terms of simultaneous control over phase composition and 3D nanostructure. Herein, M13 bacteriophage is employed as a biological scaffold to develop 3D nickel phosphide nanofoams with control over a range of phase compositions and structural elements. Virus‐templated Ni5P4 nanofoams are then integrated as thin‐film negative electrodes in lithium‐ion microbatteries, demonstrating a discharge capacity of 677 mAh g–1 (677 mAh cm–3) and an 80% capacity retention over more than 100 cycles. This strong electrochemical performance is attributed to the virus‐templated, nanostructured morphology, which remains electronically conductive throughout cycling, thereby sidestepping the need for conductive additives. When accounting for the mass of additional binder materials, virus‐templated Ni5P4 nanofoams demonstrate the highest practical capacity reported thus far for Ni5P4 electrodes. Looking forward, this synthesis method is generalizable and can enable precise control over the 3D nanostructure and phase composition in other metal phosphides, such as cobalt and copper.

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Electroless Deposition of Nickel

Cited by 51 publications

References 22 publications

Electroless and Immersion Plating Process towards Structures and IMC Formation

Electroless and Immersion Plating Process towards Structures and IMC Formation

Shrink-induced sorting using integrated nanoscale magnetic traps

Virus‐Templated Nickel Phosphide Nanofoams as Additive‐Free, Thin‐Film Li‐Ion Microbattery Anodes

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