Electroless deposition surface engineering of boron nitride sheets for enhanced thermal conductivity and decreased interfacial thermal resistance of epoxy composites

Liang, Yunmin; Zhang, Bo; Liu, Zhichun; Liu, Wei

doi:10.1016/j.ijheatmasstransfer.2021.121306

Cited by 16 publications

(8 citation statements)

References 41 publications

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“…This indicated that the carbonized skeleton could more effectively construct the heat conduction path. Furthermore, to demonstrate the superiority of our 3D BN/C/EP composites, the epoxy composites prepared in this work had better thermal management properties compared to previously reported polymer composites filled with boron nitride and its derivatives, as shown in Figure d. ,− More information is provided in Table S3.…”

Section: Resultsmentioning

confidence: 69%

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

Jiang

Sun

ShangGuan

et al. 2022

ACS Appl. Mater. Interfaces

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The construction of an interconnected nanofiller network is critical for the preparation of highly effective thermal management composites, though it remains a challenge to eliminate the anisotropic thermal conductivity of the nanofiller-induced defective interfacial heat-flow efficiency. In this work, a facile and novel approach is proposed to optimize phonon transport by building a salt template-assisted three-dimensional (3D) carbonization nanohybrid network in an epoxy system. The advantage of the salt template relied on green and scalable merits to construct a 3D nanofiller network and supporting abundant holes for the introduction of a polymer matrix after washing. Meanwhile, the contained carbonization materials contributed to reducing the interfacial phonon scattering issues of the filler/filler and filler/ polymer for an efficient heat-flow pathway. As a result of this effect, the prepared epoxy nano-composites presented a high thermal conductivity of 4.27 W/m K, resulting in a 1841% increase compared to the thermal conductivity of the pure epoxy resin. In addition, the epoxy composites exhibited good mechanical properties and thermal conductive performance during heating and cooling. Therefore, this study may provide new insights into the design and preparation of thermal management polymers to meet the applicational requirements of electronics.

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Section: Resultsmentioning

confidence: 69%

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

Jiang

Sun

ShangGuan

et al. 2022

ACS Appl. Mater. Interfaces

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“…50 The Agari model, for example, is useful in high-packing-load systems where thermal conductivity channels can be constructed. The Y.Agari model's logarithmic equation is Equation (2) 51,52 :…”

Section: Resultsmentioning

confidence: 99%

“…The Agari model, for example, is useful in high‐packing‐load systems where thermal conductivity channels can be constructed. The Y.Agari model's logarithmic equation is Equation () 51,52 :

\begin{matrix} \log λ_{C} = {VC}_{2} \log λ_{F} + ((), 1 - V) \end{matrix}

where 𝐶 1 represents the effect of the fillers on the polymer crystallinity or crystal size and 𝐶 2 represents the ability of the filler particles to form a thermally conductive network, and the larger the value, the stronger the ability of the filler to form a thermally conductive network in the composite system, but generally the value of 𝐶 2 is controlled between 0 and 1. λ C , λ F , and λ P represent thermal conductivity of the EP‐based composites; V is the volume/weight fraction of BN filler, thermal conductive fillers (mainly BN ~ 300 W/mK), and pure EP (0.22 W/mK), respectively. As depicted in Figure 6C, The estimated thermal conductivity curves for composites from the Y.Agari model closely match the experimental observations, with correlation coefficients ( R 2 ) of 0.9868 and 0.9952, respectively.…”

Section: Resultsmentioning

confidence: 99%

Preparation of functionalized boron nitride sheets/epoxy resin composites by using a green and efficient approach for elevated thermal conductivity

Jiang,

BinteTouhid,

Sun

et al. 2023

Polymer Composites

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With the rapid evolution of integrated circuits and electronic devices, considerable research efforts are dedicated to thermally conductive but electrically insulative composites that may successfully allay “hot spot” concerns during device operation. In this study, a green, cheaply and effective method was proposed to improve thermal conductivity coefficient (λ) of boron nitride/epoxy composites by modifying boron nitride sheet (BN) surface with TACu nanoparticles that synthesized from tannic acid (TA) and copper sulphate. As a result, the TACu nanoparticles and BN work in concert to improve the thermal conductivity of the BN/epoxy composite. The ideal thermal conductivity coefficient, 1.61 W/mK, was present when the mass fraction of the created filler, BN@TACu, is 30 wt%. This value is 7.3 times higher than that of pure epoxy resin (0.22 W/mK) and significantly higher than the reported BN/epoxy composites containing 30 wt% fillers. Moreover, the interface compatibility between BN and epoxy resin is also significantly improved by the TACu nanoparticles on BN surfaces, giving the composites improved thermal and mechanical characteristics. This technology for BN surface modification has a lot of practical potential in the present electronic sector since it is relatively straightforward and easy to scale up.

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“…Then, the FTIR spectrometer, TENSOR27, was implemented to analyze the FTIR spectra of hydroxyl and epoxy functional groups in epoxy resins. [21,36,37] 3. Model of ITR…”

Section: High-temperature Agingmentioning

confidence: 99%

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

Wang

Zhao

et al. 2022

Adv Materials Inter

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heat transfer performance of TIM, and the test methods normally include two categories: steady-state and transient methods. However, the present ITR testing methods still suffer from sample damage and low accuracy. [4] Thus, a non-destructive ITR testing method with high accuracy is urgently needed, which is critical for promoting the development of TIM.Submicron silver has become a promising TIM owing to its high thermal conductivity and strong adhesion, which can greatly reduce the ITR. [5][6][7][8] However, the thermal reliability of the silver-adhesive interface is still a major issue. Numerous studies focused on the degradation of properties, such as mechanical strength, material oxidation, and electrochemical corrosion through the test of high temperature, high humidity, and temperature cycling. [9][10][11][12][13][14] Liu et al. reported that conductive adhesive would undergo further curing, hydrolysis, and oxidation under high temperature and humidity, but it did not provide in-depth theoretical explanations. [15] Lin et al. found that the hydrothermal environment induced the hygroscopic expansion of epoxy resin and weakened the absorption peak of the epoxyfunctional group by Fourier transforming infrared (FTIR) spectrum analysis. [16] Several studies hypothesized that the number, size, and shape of porosity would interrupt the interface thermal conduction path, and thus, decrease the equivalent thermal conductivity. However, the evolution of porosity during the aging process is not investigated. [17][18][19] Skuriat studied the change in micro-morphology under high-temperature aging of Thermal interface materials (TIM) represented by submicron silver adhesive provide a promising solution for ultra-high heat dissipation in chip integration. However, it is difficult to accurately characterize the thermal performance of submicron silver adhesive interfaces, and their high-temperature degradation mechanism still remains unclear. Herein, the accelerated high-temperature aging experiments of submicron silver adhesion interfaces are performed, and a non-destructive testing method is provided to measure the degeneration of interfacial thermal resistance (ITR). After performing the two-sided test, ITR can be extracted with an error of less than 4.6%. Based on scanning electron microscopy and X-ray microstructural analysis, the microstructural evolution of silver adhesive interfaces is presented and its high-temperature degradation mechanism is determined. It is observed for the first time that ITR would change with the aging time following a bathtub curve. Such a degenerative process can be evidently divided into three stages including secondary solidification, fluctuation, and failure. In addition, a physical model is developed to interpret the degradation mechanism of ITR at high temperatures. The change in the trend of submicron silver body and TIM-solid contact thermal resistance at different stages is presented. This work helps promote submicron silver's application as high-performance TIM.

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Electroless deposition surface engineering of boron nitride sheets for enhanced thermal conductivity and decreased interfacial thermal resistance of epoxy composites

Cited by 16 publications

References 41 publications

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

Facile Strategy for Constructing Highly Thermally Conductive Epoxy Composites Based on a Salt Template-Assisted 3D Carbonization Nanohybrid Network

Preparation of functionalized boron nitride sheets/epoxy resin composites by using a green and efficient approach for elevated thermal conductivity

High‐Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

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