Electroless Ni–Cu–P plating onto open cell stainless steel foam

Aal, A. Abdel; Aly, Mohamed Shehata

doi:10.1016/j.apsusc.2009.02.073

Cited by 34 publications

(9 citation statements)

References 24 publications

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“…For a given temperature, the deposition rate decreased with increasing Cu 2+ concentration in the solution. This is in agreement with the some previous studies . As mentioned previously, some inconsistent results were also found .…”

Section: Resultssupporting

confidence: 93%

“…This can be also attributed to the much greater reduction potential of cupric ions than nickel ions. Thus, copper ions have a greater preference to be deposited on the plating frontier than nickel ion, especially in the initial stage of the plating . According to the different Cu content in coatings obtained at different CuSO 4 •5H 2 O concentration, the corresponding coatings were labeled as Ni‐P‐1.3 wt% Cu, Ni‐P‐2.2 wt% Cu, Ni‐P‐3.9 wt% Cu, Ni‐P‐7.4 wt% Cu, respectively.…”

Section: Resultsmentioning

confidence: 99%

“…Although electroless nickel and copper platings on fabrics for EMI shielding have been studied recently, electrical properties, especially the EMI shielding property of ternary Ni‐P‐Cu plated polymer composites and their dependence on Cu content have not been revealed. And there were also a few works about the influence of Cu content on the deposition rate and coating structure, but some inconsistent results were found. For example, the deposition rate was found to decrease with the cupric ions concentration in many studies , but some researchers drew precisely the opposite conclusion .…”

Section: Introductionmentioning

confidence: 99%

“…And there were also a few works about the influence of Cu content on the deposition rate and coating structure, but some inconsistent results were found. For example, the deposition rate was found to decrease with the cupric ions concentration in many studies , but some researchers drew precisely the opposite conclusion .…”

Section: Introductionmentioning

confidence: 99%

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Electromagnetic shielding and corrosion resistance of electroless Ni-P and Ni-P-Cu coatings on polymer/carbon fiber composites

Zhou

Liu

et al. 2014

Polym. Compos.

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In order to study electrical properties, especially the electromagnetic interference (EMI) shielding property of ternary Ni‐P‐Cu plated polyether ether ketone/carbon fiber composites (CFs/PEEK) and their dependence on Cu content of the coating, electroless Ni‐P coating was first deposited on CFs/PEEK to obtain the optimum conditions for deposition rate, then a small quantity of CuSO4•5H2O (0.1∼0.4 g/L) was added in the electroless nickel‐based alloy plating (ENP) bath to investigate the influence of Cu content on the deposition rate and coating characterizations. The EMI shielding effectiveness (SE) was evaluated and corrosion resistance was characterized by electrochemical polarization measurement. It was found that coating phase change from amorphous to a mixture of amorphous and microcrystalline phases with the increase of Cu2+ concentration. Due to the neat morphology and uniform amorphous structure, the optimum coating Ni‐P‐2.2 wt% Cu obtained at the 0.2 g/L Cu2+ in the bath owns the best corrosion resistance, EMI SE and the lowest surface resistance. POLYM. COMPOS., 36:923–930, 2015. © 2014 Society of Plastics Engineers

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Section: Resultssupporting

confidence: 93%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Electromagnetic shielding and corrosion resistance of electroless Ni-P and Ni-P-Cu coatings on polymer/carbon fiber composites

Zhou

Liu

et al. 2014

Polym. Compos.

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“…The choice of the third particle depends on the desired property. Ternary Ni-P coatings, such as Ni-Cu-P [2, 3], Ni-W-P [4–8], Ni-P-PTFE [9, 10], Ni-P-SiC [11, 12], Ni-P-Al 2 O 3 [13, 14], and Ni-P-TiO 2 [15–17], have been investigated by different researchers. Among the ternary Ni-P alloy coatings, the electroless Ni-Cu-P alloy presents superior corrosion resistance and thermal conductivity than others [18–23].…”

Section: Introductionmentioning

confidence: 99%

An Experimental Approach for Optimizing Coating Parameters of Electroless Ni-P-Cu Coating Using Artificial Bee Colony Algorithm

Roy

Sahoo

2014

International Scholarly Research Notices

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This paper aims to present an experimental investigation for optimum tribological behavior (wear depth and coefficient of friction) of electroless Ni-P-Cu coatings based on four process parameters using artificial bee colony algorithm. Experiments are carried out by utilizing the combination of three coating process parameters, namely, nickel sulphate, sodium hypophosphite, and copper sulphate, and the fourth parameter is postdeposition heat treatment temperature. The design of experiment is based on the Taguchi L27 experimental design. After coating, measurement of wear and coefficient of friction of each heat-treated sample is done using a multitribotester apparatus with block-on-roller arrangement. Both friction and wear are found to increase with increase of source of nickel concentration and decrease with increase of source of copper concentration. Artificial bee colony algorithm is successfully employed to optimize the multiresponse objective function for both wear depth and coefficient of friction. It is found that, within the operating range, a lower value of nickel concentration, medium value of hypophosphite concentration, higher value of copper concentration, and higher value of heat treatment temperature are suitable for having minimum wear and coefficient of friction. The surface morphology, phase transformation behavior, and composition of coatings are also studied with the help of scanning electron microscopy, X-ray diffraction analysis, and energy dispersed X-ray analysis, respectively.

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Solid State Porous Metal Production: A Review of the Capabilities, Characteristics, and Challenges

et al. 2018

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Porous metals have been under development for nearly a century, but commercial adoption remains limited. This development has followed two primary routes: liquid state or solid state processing. Liquid state foaming introduces porosity to a liquid or semi‐solid metal, and solid state foaming introduces porosity to a metal, which is fully solid. Either method may create pores by internal gas pressure or introducing metal around a template directly control porosity. Process optimization and commercial output has been primarily related to liquid state methods, as solid state processing is often more complex, diverse, and with lower throughput. Solid state methods, however, are often more versatile and offer greater control of pore characteristics. Ongoing advancements in solid state foaming have allowed for a wide array of metals and alloys to be made porous and the three‐dimensional structure to be precisely tailored. In general, solid state processing remains limited to niche applications, often with modest dimensions (cm scale). “Traditional” solid state processes are being further refined and extended, and continuing developments to reduce cost, increase output, and control pore characteristics are likely to produce important advancements in coming years. The extensive variability of pore quantity and morphology makes solid state processes suitable, and often preferable, for an assortment of functional and structural applications, with electrodes and biomedical devices being among the most popular in current research. Various techniques for introducing porosity, the way these methods are applied, important considerations, typical outcomes, and current applications are reviewed.

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Electroless Ni–Cu–P plating onto open cell stainless steel foam

Cited by 34 publications

References 24 publications

Electromagnetic shielding and corrosion resistance of electroless Ni-P and Ni-P-Cu coatings on polymer/carbon fiber composites

Electromagnetic shielding and corrosion resistance of electroless Ni-P and Ni-P-Cu coatings on polymer/carbon fiber composites

An Experimental Approach for Optimizing Coating Parameters of Electroless Ni-P-Cu Coating Using Artificial Bee Colony Algorithm

Solid State Porous Metal Production: A Review of the Capabilities, Characteristics, and Challenges

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