2003
DOI: 10.1179/000844303794406143
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Electroless Nickel Boron Plating on Aa6061

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Cited by 3 publications
(11 citation statements)
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“…[18] An additional increase in the bath pH slightly decreases the plating rate. The decrease in the deposition rate with the increase in the bath pH in the alkaline region (pH > 7) is in agreement with the results reported by Dadvand [6] for the EN-P plating of an aluminum alloy substrate. The activity of free nickel ions decreases as the number of ligand molecules bound to the nickel ions increases.…”
Section: Effect Of Time On Thickness Of En-p Depositsupporting
confidence: 91%
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“…[18] An additional increase in the bath pH slightly decreases the plating rate. The decrease in the deposition rate with the increase in the bath pH in the alkaline region (pH > 7) is in agreement with the results reported by Dadvand [6] for the EN-P plating of an aluminum alloy substrate. The activity of free nickel ions decreases as the number of ligand molecules bound to the nickel ions increases.…”
Section: Effect Of Time On Thickness Of En-p Depositsupporting
confidence: 91%
“…24 ; the pH was adjusted to 4.87; and the temperature was 85°C. [6] Figure 9 shows the effect of citric acid (complexing agent) concentration on the deposition rate of the electroless nickel plating. It acid causes an increase in the deposition rate, which passes through a maximum as the concentration of citric acid increases.…”
Section: Effect Of Time On Thickness Of En-p Depositmentioning
confidence: 99%
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